The device must be operated below the maximum junction tem-
perature of the device, T
J
(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating T
J
. (Thermal data is also available on the
Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
qJA
, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, R
qJC
, is
a relatively small component of R
qJA
. Ambient air temperature,
T
A
, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, P
D
), can
be estimated. The following formulas represent the fundamental
relationships used to estimate T
J
, at P
D
.
P
D
= V
IN
?/DIV>
I
IN
(1)
   DT = P
D
?/DIV>
R
qJA
  (2)
   T
J
= T
A
+ 擳
  (3)
For example, given common conditions such as: T
A
= 25癈,
V
CC
= 12 V, I
CC
= 7 mA, and R
qJA
= 126 癈/W, then:
P
D
= V
CC
?/DIV>
I
CC
= 12 V
?/DIV>
7 mA = 84 mW
DT = P
D
?/DIV>
R
qJA
= 84 mW
?/DIV>
126 癈/W = 10.6癈
T
J
= T
A
+ DT = 25癈 + 10.6癈 = 35.6癈
A worst-case estimate, P
D
(max), represents the maximum allow-
able power level (V
CC
(max), I
CC
(max)), without exceeding
T
J
(max), at a selected R
qJA
and T
A
.
Example: Reliability for V
CC
at T
A
=
150癈.
Observe the worst-case ratings for the device, specifically:
R
qJA
=
126癈/W, T
J
(max)
=
165癈, V
CC
(max)
=
24
V, and
I
CC
=
16.8
mA.
Calculate the maximum allowable power level, P
D
(max). First,
invert equation 3:
DT(max) = T
J
(max) T
A
= 165
癈
150
癈 = 15
癈
This provides the allowable increase to T
J
resulting from internal
power dissipation. Then, invert equation 2:
P
D
(max)
= DT(max)
?R
qJA
= 15癈 ?126 癈/W = 119 mW
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D
(max)
? I
CC
= 119 mW ?16.8 mA = 7.1V
The result indicates that, at T
A
, the application and device can
dissipate adequate amounts of heat at voltages dV
CC(est)
.
Compare V
CC(est)
to V
CC
(max). If V
CC(est)
d V
CC
(max), then reli-
able operation between V
CC(est)
and V
CC
(max) requires enhanced
R
qJA
. If V
CC(est)
e V
CC(max)
, then operation between V
CC(est)
and
V
CC
(max) is reliable under these conditions.
Power Derating
Miniature, Two-Wire, True Zero Speed
Differential Peak-Detecting Sensor IC
ATS682LSH
14
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
相關代理商/技術參數 |
參數描述 |
ATS684LSNTN-T |
功能描述:TWO-WIRE DIFF SPEED SENSOR IC WI 制造商:allegro microsystems, llc 系列:- 包裝:剪切帶(CT) 零件狀態:在售 功能:專用型 技術:霍爾效應 極化:單向 感應范圍:70% 跳閘,30% 釋放 測試條件:25°C 電壓 - 電源:4 V ~ 24 V 電流 - 電源(最大值):16mA 電流 - 輸出(最大值):- 輸出類型:電流源 特性:- 工作溫度:-40°C ~ 150°C 封裝/外殼:3-SIP 供應商器件封裝:3-SIP 標準包裝:1 |
ATS685LSH |
制造商:ALLEGRO 制造商全稱:Allegro MicroSystems 功能描述:Two-Wire, Zero Speed Differential Gear Tooth Sensor IC |
ATS685LSHTN-T |
功能描述:IC HALL EFFECT GEAR SENSOR 4SIP RoHS:是 類別:傳感器,轉換器 >> 磁性 - 霍爾效應,數字式開關,線性,羅盤 (IC) 系列:- 標準包裝:1 系列:- 傳感范圍:20mT ~ 80mT 類型:旋轉 電源電壓:4.5 V ~ 5.5 V 電流 - 電源:15mA 電流 - 輸出(最大):- 輸出類型:數字式,PWM,8.5 位串行 特點:可編程 工作溫度:-40°C ~ 150°C 封裝/外殼:20-SSOP(0.209",5.30mm 寬) 供應商設備封裝:20-SSOP 包裝:Digi-Reel® 其它名稱:AS5132-HSST-500DKR |
ATS692LSHTN-RSNPH-T |
功能描述:IC HALL EFFECT SENSOR 4SIP 制造商:allegro microsystems, llc 系列:- 包裝:帶卷(TR) 零件狀態:有效 功能:專用型 技術:霍爾效應 極化:- 感應范圍:69% 跳閘,31% 釋放 測試條件:-40°C ~ 150°C 電壓 - 電源:4 V ~ 24 V 電流 - 電源(最大值):16.5mA 電流 - 輸出(最大值):- 輸出類型:電流 特性:- 工作溫度:-40°C ~ 150°C(TA) 封裝/外殼:4-SIP 模塊 供應商器件封裝:4-SIP 標準包裝:800 |
ATS693LSGTN-RSNYPH-T |
功能描述:IC HALL EFFECT SENSOR 4SIP 制造商:allegro microsystems, llc 系列:- 包裝:帶卷(TR) 零件狀態:有效 功能:專用型 技術:霍爾效應 極化:- 感應范圍:69% 跳閘,31% 釋放 測試條件:-40°C ~ 150°C 電壓 - 電源:4 V ~ 24 V 電流 - 電源(最大值):16.5mA 電流 - 輸出(最大值):- 輸出類型:電流 特性:- 工作溫度:-40°C ~ 150°C(TA) 封裝/外殼:4-SIP 模塊 供應商器件封裝:4-SIP 標準包裝:800 |
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