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參數資料
| 型號： | B1SGS |
| 廠商： | Comchip Technology Co., Ltd. |
| 英文描述： | SMD Genenal Purpose Bridge Rectifier |
| 中文描述： | 貼片Genenal目的橋式整流器 |
| 文件頁數： | 1/2頁 |
| 文件大小： | 79K |
| 代理商： | B1SGS |
Glass Passivated Type
Reverse Voltage: 50 - 1000 Volts
Forward Current: 0.5 Amp
B05S
GS
Thru B10S
GS
Features
Ideal for surface mount applications
Easy pick and place
Plastic package has Underwriters Lab.
flammability classification 94V-0
Built-in strain relief
Glas passivated junction
Mechanical data
Case: JEDEC DO-269AA molded plastic
Terminals: solderable per MIL-STD-750,
method 2026
Polarity: Marked on body
Mounting position: Any
Approx. Weight:0.22 gram
SMD Genenal Purpose Bridge Rectifier
www.comchip.com.tw
COMCHIP
Parameter
Max. Repetitive Peak Reverse Voltage
Max. DC Blocking Voltage
Max. RMS Voltage
Peak Surge Forward Current
8.3ms single half sine-wave
superimposed on rate load
( JEDEC method )
Max. Average Forward Current
Max. Instantaneous Forward Current
at 0.5 A
Max. DC Reverse Current at Rated DC
Blocking Voltage Ta=25
Ta=125
C
Max. Thermal Resistance (Note 1)
Operating Junction Temperature
Storage Temperature
Symbol
V
RRM
V
DC
V
RMS
I
FSM
I o
V
F
I
R
R
JA
T j
T
STG
Maximum Ratings and Electrical Characterics
Unit
V
V
V
A
A
V
uA
MDS0212005A
Page 1
Note 1: Thermal resistance from junction to ambient.
50
50
35
1000
1000
700
600
600
420
400
400
280
100
100
70
30
0.5
1.0
-55 to +150
5
500
-55 to +150
B05S
GS
B1S
GS
B2S
GS
B4S
GS
B6S
GS
B8S
GS
B10S
GS
800
800
560
200
200
140
85
C/W
C
C
C
Dimension in inches and (millimeters)
TO-269AA
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