
BAS16/MMBD4148/MMBD914
SURFACE MOUNT SWITCHING DIODE
Features
Fast Switching Speed
Surface Mount Package Ideally Suited for Automatic
Insertion
For General Purpose Switching Applications
High Conductance
Lead Free/RoHS Compliant (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT-23
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
Polarity: See Diagram
Marking Information: KA6, KA2, K5D; See Page 3
Ordering Information: See Page 3
Weight: 0.008 grams (approximate)
SOT-23
Min
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013
0.903
0.45
0.085
0
°
Dim
A
B
C
D
E
G
H
J
K
L
M
α
All Dimensions in mm
Max
0.51
1.40
2.50
1.03
0.60
2.05
3.00
0.10
1.10
0.61
0.180
8
°
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
V
RM
V
RRM
V
RWM
V
R
V
R(RMS)
100
V
75
V
53
V
Forward Continuous Current (Note 1)
I
FM
300
mA
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Power Dissipation (Note 1)
I
O
200
2.0
1.0
350
mA
@ t = 1.0
μ
s
@ t = 1.0s
I
FSM
A
P
d
mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θ
JA
357
°
C/W
Operating and Storage Temperature Range
T
j
, T
STG
-65 to +150
°
C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
75
V
I
R
= 100
μ
A
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
V
R
= 75V
V
R
= 75V, T
j
= 150
°
C
V
R
= 25V, T
j
= 150
°
C
V
R
= 20V
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100
Ω
Forward Voltage
V
F
0.715
0.855
1.0
1.25
1.0
50
30
25
2.0
V
Leakage Current (Note 2)
I
R
μ
A
μ
A
μ
A
nA
pF
Total Capacitance
C
T
Reverse Recovery Time
t
rr
4.0
ns
Notes:
1. Device mounted on glass epoxy PCB 1.6” x 1.6” x 0.06”; mounting pad for the cathode lead min. 0.93in
2
.
2. Short duration test pulse used to minimize self-heating effect.
3. No Purposefully added Lead.
DS12003 Rev. 19 - 2
1 of 3
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BAS16/MMBD4148/MMBD914
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