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參數(shù)資料
| 型號(hào)： | BD2425P50100AHF |
| 廠商： | Anaren |
| 文件頁(yè)數(shù)： | 4/5頁(yè) |
| 文件大小： | 3429K |
| 描述： | XFRMR BALUN RF 2400-2500MHZ 0404 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Xinger® |
| 頻率范圍： | 2400 ~ 2500 MHz |
| 阻抗 - 不平衡/平衡： | 50 / 100 歐姆 |
| 相差： | 6° |
| 插入損耗（最大值）： | 0.9dB |
| 回程損耗（最小值）： | 19.0dB |
| 封裝/外殼： | 4-SMD，無(wú)引線 |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 1173-1068-6 |
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model BD2425P50100AHF
REV A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/
o
C.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
With No DC Bias
With DC Bias
Plated thru
hole to
ground
Solder Resist
Footprint Pad (s)
Circuit Pattern
3X Transmission
Line
3X .011
[0.29]
3X .011
[0.29]
.020
[0.50]
.020
[0.50]
Dimensions are in Inches [Millimeters]
Mounting Footprint
.008 [0.21]
.008 [0.21]
.014 [0.36]
Plated thru
hole to
ground
Solder Resist
Footprint Pad (s)
Circuit Pattern
3X Transmission
Line
3X .011
[0.29]
3X .011
[0.29]
.020
[0.50]
.020
[0.50]
Dimensions are in Inches [Millimeters]
Mounting Footprint
.008 [0.21]
.008 [0.21]
.014 [0.36]
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BD2425P5075AHF | 制造商:Anaren Microwave 功能描述:BALUN TRANSFORMER |
| BD2-4281U | 制造商:Citizen Systems America Corporation 功能描述:Line Thermal Printer Mechanisms |
| BD242A | 功能描述:兩極晶體管 - BJT 40W PNP Silicon RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| BD242A-S | 功能描述:兩極晶體管 - BJT 60V 3A PNP RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| BD242ATU | 功能描述:兩極晶體管 - BJT PNP Epitaxial Sil RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
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