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參數資料
型號: BP660B-0.0055-00-1112
廠商: Bergquist
文件頁數: 1/1頁
文件大小: 0K
描述: THERMAL PAD ADHESIVE 11"X12"
標準包裝: 1
系列: Bond-Ply® 660B
使用: 片狀
形狀: 矩形
外形: 304.80mm x 279.40mm
厚度: 0.0055"(0.140mm)
材質: 丙烯酸
膠合劑: 粘貼 - 雙側
背襯,載體: 聚萘二甲酸乙二醇酯(PEN)
顏色:
熱電阻系數: 0.58°C/W
導熱性: 0.4 W/m-K
其它名稱: BP660B-0.0055-1112-NA
Q2368566
Q3186179
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_BP_660P_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Bond-Ply 660P
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape
Features and Benefits
Thermal impedance:
0.87°C-in2/W (@50 psi)
Highly puncture resistant Polyimide
reinforcement carrier
Double-sided pressure sensitive
adhesive tape
Provides a mechanical bond, eliminating the
need for mechanical fasteners or screws
Bond-Ply 660P is a thermally conductive, electri-
cally insulating, double sided pressure sensitive
adhesive tape.The tape consists of a high per-
formance, thermally conductive acrylic adhesive
coated on both sides of a Polyimide film. Use
Bond-Ply 660P in applications to replace
mechanical fasteners or screws.
Typical Applications
Include:
Heat sink onto BGA graphic processor
Heat sink onto drive processor
Heat spreader onto power converter PCB
Heat spreader onto motor control PCB
Configurations Available:
Roll form and die-cut parts
The material as delivered will include a
continuous base liner with differential release
properties to allow for simplicity in roll
packaging and application assembly.
Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires
the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a
6-month shelf life at a maximum continuous storage temperature of 35°C, or 3-month shelf life at
a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is
often not critical for manual assembly processing), is recommended at 12 months from date of
manufacture at a maximum continuous storage temperature of 60°C.
Building a Part Number
Standard Options
Bond-Ply
: U.S. Patent 5,090,484 and others.
Section
A
Section
B
Section
C
Section
D
Section
E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
BP660P = Bond-Ply 660P Material
BP660P
0.008
00
11/250
NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.008"
00 = No adhesive
11/250 = 11" x 250' rolls or 00 = custom configuration
––
TYPICAL PROPERTIES OF BOND-PLY 660P
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Light Brown
Visual
Reinforcement Carrier
Polyimide Film
Thickness (inch) / (mm)
0.008
0.203
ASTM D374
Glass Transition (°F) / (°C)
-22
-30
ASTM E1356
Continuous Use Temp (°F) / (°C)
-22 to 248
-30 to 120
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
ELECTRICAL
VALUE
TEST METHOD
Dielectric Breakdown Voltage (kVAC)
6000
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Post-Cured Thermal Conductivity (W/m-K)
0.4
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
5.48
5.47
5.15
5.05
5.00
Thermal Impedance (°C-in2/W) (1)
0.83
0.82
0.81
0.80
0.79
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
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