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參數資料
| 型號： | C93-2002 |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | DIP20, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數： | 1/1頁 |
| 文件大小： | 453K |
| 代理商： | C93-2002 |
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Anti-wicking design on LO-PROfile sockets eliminates flux or solder contamination
Dual beam, edge-grip contacts provide high retention and positive contact
End-to-end and side-to-side stackable
SPECIFICATIONS
Body: black UL-94V-0 glass-filled Nylon 4/6
Dual Beam Contact: Phosphor Bronze Alloy 521
Contact Plating: (overall) 50μ [1.27μ] Nickel per SAE-AMS-QQN-290); Tin 200μ
[5.08μ] min. matte Tin per ASTM B545-97; Tin/Lead 100-150μ [2.54-3.81μ]
min. 90/10 Tin/Lead per MIL-P-81728; Gold 10μ [0.25μ] min. Gold per MIL-
G-45204 in contact area and 100-150μ [2.54-3.81μ] min 90/10 Tin/Lead per
MIL-P-81728 on Solder Tail
Wafer: Nomex, 0.005 [0.13] thick
Contact Current Rating: 1 amp
Contact Resistance: 20 MOhms initial
Insulation Resistance: 100 MOhms @ 500VDC per MIL-STD-1344, Method
3003.1
Dielectric Withstanding Voltage: 1000VAC
Operating Temperature: -67°F to 221°F [-55°C to 105°C] Tin = -67°F to 257°F [-55°C to 125°C] Gold
Accepts Leads: up to 0.011 x 0.018 ±0.003 [0.28 x 0.46 ±0.08] or 0.021 [0.53] diameter, 0.070-0.135 [1.78-3.43] long
MOUNTING CONSIDERATIONS
Suggested PCB Hole Size: 0.036 ±0.002 [0.91 ±0.05] diameter
12001
Rev. F
Series C84/93 LO-PROfile Dual Beam
Solder Tail Edge-Grip Sockets
NOTE: Aries specializes in custom design and production.
In addition to the standard products shown on this page,
special materials, platings, sizes, and configurations can
be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
No. of Pins
Dim “A”
Dim. “B”
Centers “C”
Dim. “D”
Dim. “E”
Dim. “F”
6
0.290 [7.37]
0.200 [5.08]
0.300 [7.62]
0.395 [10.03]
—
8
0.390 [9.91]
0.300 [7.62]
0.395 [10.03]
—
14
0.690 [17.53]
0.600 [15.24]
0.300 [7.62]
0.395 [10.03]
—
0.350 [8.89]
16
0.790 [20.07]
0.700 [17.78]
0.300 [7.62]
0.395 [10.03]
—
0.400 [10.16]
18
0.890 [22.61]
0.800 [20.32]
0.300 [7.62]
0.395 [10.03]
—
0.450 [11.43]
20
0.990 [25.15]
0.900 [22.86]
0.300 [7.62]
0.395 [10.03]
—
0.500 [12.70]
24
1.190 [30.23]
1.100 [27.94]
0.600 [15.24]
0.695 [17.65]
0.400 [10.16]
—
28
1.390 [35.31]
1.300 [33.02]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
—
40
1.990 [50.55]
1.900 [48.26]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
1.000 [25.40]
ORDERING INFORMATION
C XX - XX XX - TL
Socket Series
Pin Plating
93 = Gold
84 = Tin
No. of Pins
(see Table)
Plating Option
Tin/Lead
02 = Nomex Wafer (std)
ALL DIMENSIONS: INCHES [MILLIMETERS]
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相關代理商/技術參數 |
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| C9320-02 | 功能描述:IC 與器件插座 LO-PROFILE 20 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9322-02 | 功能描述:IC 與器件插座 LO-PROFILE 22 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9324-02 | 功能描述:IC 與器件插座 LO-PROFILE 24 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9324-03 | 功能描述:IC 與器件插座 24P SOCKET GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9328-02 | 功能描述:IC 與器件插座 LO-PROFILE 28 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
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