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參數資料
| 型號： | CGA-6618Z |
| 英文描述： | Dual CATV 1 MHz to 1000 MHz High Linearity GaAs HBT Amplifier |
| 中文描述： | 雙有線電視1 MHz到1000 MHz的高線性度砷化鎵異質結雙極晶體管放大器 |
| 文件頁數： | 1/8頁 |
| 文件大小： | 307K |
| 代理商： | CGA-6618Z |
Preliminary
Product Description
Sirenza Microdevice’s CGA-6618 is a high performance GaAs
HBT MMIC Amplifier. Designed with the InGaP process technol-
ogy for excellent reliability. A Darlington configuration is utilized
for broadband performance. The heterojunction increases
breakdown voltage and minimizes leakage current between
junctions. The CGA-6618 contains two amplifiers for use in
wideband Push-Pull CATV amplifiers requiring excellent second
order performance. The second and third order non-linearities
are greatly improved in the push pull configuration.
EDS-101994 Rev J
1
303 S. Technology Ct., Broomfield, CO 80021 Phone: (800) SMI-MMIC http://www.sirenza.com
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
CGA-6618
CGA-6618Z
Pb
Dual CATV 1 MHz to 1000 MHz
High Linearity GaAs HBT Amplifier
RoHS Compliant
&
Green
Product Features
Now available in Lead Free, RoHS
Compliant, & Green Packaging
Excellent CSO/CTB/XMOD at
+34 dBmV Output Power per Tone
Dual Devices in each SOIC-8 Package simplify
Push-Pull configuration PC board layout
Applications
CATV Head End Driver and Predriver Amplifier
CATV Line Driver Amplifier
The matte tin finish on Sirenza’s lead-free package utilizes a post
annealing process to mitigate tin whisker formation and is RoHS
compliant per EU Directive 2002/95. This package is also manu-
factured with green molding compounds that contain no antimony
trioxide nor halogenated fire retardants.
S ym b o l
P aram eter
F req .(M H z )
50
500
870
1000
50
250
500
50
500
870
50
500
870
500
100-870
M in .
Typ .
13.8
14.1
13.4
13.0
76.5
77.5
72.0
38.0
39.0
40.0
20.0
21.0
21.5
15.5
M ax.
U n its
G
S m all S ignal G ain
12.4
12.0
14.4
14.0
dB
O IP 2
O utput S econd O rder Intercept P oint
Tone Spacing = 1 M Hz, P out per tone = +6 dB m
70.0
dB m
O IP 3
O utput Third O rder Intercept P oint
Tone Spacing = 1 M Hz, P out per tone = +6 dB m
38.0
dB m
P 1dB
O utput P ower at 1dB G ain C om pression
19.5
dB m
IRL
Input Return Loss
10
dB
O RL
O utput Return Loss
500
100-870
50
500
870
9.0
12.5
dB
NF
Noise F igure
B alun Insertion Loss Included
5.3
5.4
5.6
81
70
63
5.1
160
6.6
dB
C S O
C TB
X M O D
V
D
I
D
W orst C ase O ver B and, 79 C h., F lat, +34dB m V
W orst C ase O ver B and, 79 C h., F lat, +34dB m V
W orst C ase O ver B and, 79 C h., F lat, +34dB m V
D evice O perating Voltage
D evice O perating C urrent
dB c
dB c
dB c
V
m A
4.8
144
5.4
176
R
TH(J-L)
Therm al Resistance (Junction to Lead)
35
°C /W
1
2
3
4
8
7
6
5
Amplifier
Configuration
Test Conditions:
V
S
= 8 V I
D
= 160 mA Typ. R
BIAS
= 33 Ohms T
L
= 25oC Z
S
= Z
L
= 75 Ohms Push Pull Application Circuit
ELECTRICAL SPECIFICATIONS
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