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參數(shù)資料
型號: CGP15
廠商: Vishay Intertechnology,Inc.
英文描述: Miniature Clamper/Damper Glass Passivated Rectifier
中文描述: 微型夾緊/阻尼器的玻璃鈍化整流
文件頁數(shù): 1/2頁
文件大小: 33K
代理商: CGP15
CGP15 and DGP15
Vishay Semiconductors
formerly General Semiconductor
Document Number 88567
03-Jan-03
www.vishay.com
1
New Product
Miniature Clamper/Damper
Glass Passivated Rectifier
DO-204AC (DO-15)
Reverse Voltage
1400 to 1500V
Forward Current
1.5A
Patented*
0.034 (0.86)
0.028 (0.71)
Dia.
0.140 (3.6)
0.104 (2.6)
Dia.
0.230 (5.8)
0.300 (7.6)
1.0 (25.4)
min.
1.0 (25.4)
min.
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375” (9.5mm) lead length at T
A
= 50°C
Peak forward surge current 8.3ms single half sine
wave superimposed on rated load (JEDEC Method)
Maximum full load reverse current full cycle
average 0.375” (9.5mm) lead length at T
A
= 100°C
Typical thermal resistance
(Note 1)
Operating junction and storage temperature range
T
J
, T
STG
CGP15
1400
980
1400
DGP15
1500
1050
1500
Unit
V
V
V
V
RRM
V
RMS
V
DC
I
F(AV
)
1.5
A
I
FSM
40
A
I
R(AV)
50
μ
A
R
Θ
JA
55
°C/W
°C
–65 to +175
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
T
A
= 25°C
at rated DC blocking voltage
T
A
= 100°C
Maximum reverse recovery time at I
F
= 0.5A, I
R
= 50mA
Maximum reverse recovery time
typical
at I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
maximum
Typical junction capacitance at 4.0V, 1MHz
Symbol
V
F
CGP15
DGP15
Unit
V
1.1
5.0
100
I
R
μ
A
t
rr
15
20
μ
s
1.0
1.5
15
t
rr
μ
s
C
J
pF
Note:
(1) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C.B. mounted
Features
Specially designed for clamping circuits, horizontal
deflection systems and damper applications
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0.
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
1.5 ampere operation at T
A
=50°C with no thermal runaway
Typical I
R
less than 0.1
μ
A
Capable of meeting environmental standards of MIL-S-19500
High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case:
JEDEC DO-204AC, molded plastic over glass body
Terminals:
Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.015 oz., 0.4 g
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306.
Dimensions
in inches and
(millimeters)
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