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參數資料
| 型號： | CM1205-08CS |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | ESD Protection Arrays, Chip Scale Package |
| 中文描述： | ESD保護陣列，芯片級封裝 |
| 文件頁數： | 1/7頁 |
| 文件大小： | 167K |
| 代理商： | CM1205-08CS |
2003 California Micro Devices Corp. All rights reserved.
11/17/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
1
CM1205
ESD Protection Arrays, Chip Scale Package
Features
Functionally and pin compatible with CAMD’s
PACDN1404C, PACDN1408C and PACDN1416C
family of ESD protection devices
4, 8, or 16 transient voltage suppressors in a single
package
Optiguard
TM
coated for improved reliability at
assembly
In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
Applications
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
Product Description
The CM1205 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1205 features OptiGuard
TM
coating for
improved reliability at assembly and is available with
optional lead-free finishing.
Electrical Schematic
CM1205-04CS/CP
CM1205-08CS/CP
CM1205-16CS/CP
A1
A2
A3
B1
B2
B3
C2
C3
C4
D2
D3
D4
C5
D5
C1
D1
A2
A3
A4
B2
B3
B4
A5
B5
A1
B1
A2
A3
A4
B2
B3
B4
A5
B5
A1
B1
相關PDF資料 |
PDF描述 |
|---|---|
| CM1205-16CP | ESD Protection Arrays, Chip Scale Package |
| CM1205-16CS | ESD Protection Arrays, Chip Scale Package |
| CM1208-07MS | 7 & 8-Channel High-Speed ESD Protection Arrays |
| CM1208-08MR | 7 & 8-Channel High-Speed ESD Protection Arrays |
| CM1208-08MS | 7 & 8-Channel High-Speed ESD Protection Arrays |
相關代理商/技術參數 |
參數描述 |
|---|---|
| CM1205-16CP | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD Protection Arrays, Chip Scale Package |
| CM1205-16CS | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD Protection Arrays, Chip Scale Package |
| CM1206 | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD Protection Arrays, Chip Scale Package |
| CM1206-04CP | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD Protection Arrays, Chip Scale Package |
| CM1206-04CS | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD Protection Arrays, Chip Scale Package |
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