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參數(shù)資料
| 型號： | CP3SP33SMR |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interfaces |
| 中文描述： | CP3SP33連接處理器與高速緩存，DSP和藍(lán)牙，USB和雙CAN接口 |
| 文件頁數(shù)： | 1/6頁 |
| 文件大小： | 146K |
| 代理商： | CP3SP33SMR |
2005 National Semiconductor Corporation
www.national.com
C
PRELIMINARY
September 2005
CP3SP33 Connectivity Processor with Cache, DSP, and
Bluetooth
, USB, and Dual CAN Interfaces
1.0
General Description
The CP3SP33 connectivity processor combines high per-
formance with the massive integration needed for embed-
ded Bluetooth applications. A powerful RISC core with 4K-
byte instruction cache and a Teak
DSP coprocessor pro-
vides high computing bandwidth, DMA-driven hardware
communications peripherals provide high I/O bandwidth,
and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth
Lower Link Controller, Universal Serial Bus (2.0) OTG node
and host controller, dual CAN, dual Microwire/Plus/SPI,
dual ACCESS.bus, quad UART, 10-bit A/D converter, and
telematics/audio codec. Additional on-chip peripherals in-
clude DMA controller, dual CVSD/PCM conversion module,
I
2
S and AAI digital audio bus interfaces, Timing and Watch-
dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim-
er, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next gen-
eration of embedded Bluetooth products, the CP3SP33 is
backed up by the software resources that designers need
for rapid time-to-market, including an operating system,
Bluetooth protocol stack implementation, peripheral drivers,
reference designs, and an integrated development environ-
ment. Combined with an external program memory and a
Bluetooth radio transceiver such as National’s LMX5252,
the CP3SP33 provides a complete Bluetooth system solu-
tion.
National Semiconductor offers a complete and industry-
proven application development environment for CP3SP33
applications, including the IAR Embedded Workbench,
iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth
Development Board, Bluetooth protocol stack, and applica-
tion examples.
Block Diagram
Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. Teak is a registered trademark of ParthusCeva, Inc.
TRI-STATE is a registered trademark of National Semiconductor Corporation.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CP3SP33SMR/NOPB | 制造商:Texas Instruments 功能描述:IC CPU W/BLUTOOTH&CAN 144-BGA |
| CP3SP33SMRX/NOPB | 制造商:Texas Instruments 功能描述:IC CPU W/BLUTOOTH&CAN 144-BGA |
| CP3SP33SMS | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:CP3SP33 Connectivity Processor with Cache, DSP, and Bluetooth, USB, and Dual CAN Interfaces |
| CP3SP33SMS/NOPB | 制造商:Texas Instruments 功能描述:Connectivity Processor 224-Pin FBGA |
| CP3SP33SMSNOPB | 制造商:Texas Instruments 功能描述:Connectivity Processor 224-Pin FBGA |
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