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參數資料
| 型號： | CPC2-108-E-01-SG-CU |
| 廠商： | SAMTEC INC |
| 元件分類： | 插座 |
| 英文描述： | SOP8, IC SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大小： | 56K |
| 代理商： | CPC2-108-E-01-SG-CU |
SAMTEC USA Tel: 1-800-SAMTEC-9 or 812-944-6733 Fax: 812-948-5047
SAMTEC UK Tel: 01236 739292 Fax: 01236 727113
SAMTEC ASIA PACIFIC Tel: 65-745-5955 Fax: 65-841-1502
SAMTEC GERMANY Tel: +49 (0) 89 / 89460-0 Fax: +49 (0) 89 / 89460-299
SAMTEC FRANCE Tel: 01 60 95 06 60 Fax: 01 60 95 06 61
SAMTEC ITALY Tel: 39 039 6890337 Fax: 39 039 6890315
SAMTEC JAPAN Tel: 81-424-42-8318 Fax: 81-424-42-8319
SAMTEC CHINA Tel: 86-21-5385-4089 Fax: 86-21-5385-4047
SAMTEC TAIWAN Tel: (02) 2395-1677 Fax: (02) 2395-1689
Due to technical progress, all designs, specifications and components are subject to change without notice.
FACTSHEET F-200
CPC2–110–B– 01– SG
CPC2–108–B–02–SG–CU
CPC2 –116 – E– 03–SG
Choice of
(0,64mm) .025"
or
(1,27mm) .050"
pitch
Choice of cavity
up or down
Robust
Phosphor Bronze
leads with soft
gold plating
CPC2
NO. OF
POSITIONS
OTHER
OPTION
PLATING
OPTION
–SG
= 30
"
(0,76
m)
Soft Gold
(.9999 pure)
04, 08, 10, 16,
20, 24, 28
Note: Some sizes, styles and
options are non-standard,
non-returnable.
–CU Option
(Cavity up)
Leave blank
for Cavity
Down
–CU
= Cavity
Up
–LDC
= (1,52mm)
.060" thick
cupped
lid with
(0,76mm)
.030" cavity
–LDF
= (0,76mm)
.030" thick
flat lid
1
SPECIFICATIONS
Materials:
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Operating Temp Range:
-65
°C to +105°C with Tin;
-65
°C to +125°C with Gold
Plating:
Au over 50
"
(1,27
m) Ni
Current Rating:
Testing Now!
Max Processing Temp:
230
°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm) .004" max
BODY
STYLE
LEAD
PITCH
–B
= (0,64mm)
.025" Pitch
–E
= (1,27mm)
.050" Pitch
Specify
BODY
STYLE
from
chart
No. of positions x pitch / 2
+ (3,81) .150
(0,20)
.008
(0,71)
.028
TYP
No. of positions x
pitch / 2 + (1,50) .059
A
D
C
No. of positions
x pitch / 2
+ (0,08) .003
B
(2,31)
.091
(2,79)
.110
(1,65)
.065
(0,81)
.032
(1,14)
.045
BODY
STYLE
–01
–02
–03
A
(3,81)
.150
(7,62)
.300
(12,70)
.500
B
(7,54)
.297
(11,35)
.447
(16,43)
.647
C
(9,68)
.381
(13,49)
.531
(18,57)
.731
LEAD
PITCH
–B
– E
D
(0,64)
.025
(1,27)
.050
CHIP PACKAGE CPC2 SERIES
Standard Option
(Cavity down)
ALSO AVAILABLE
Optional
lids for
chip/wire
bond
protection.
相關PDF資料 |
PDF描述 |
|---|---|
| CPC2-108-E-01-SG-LDF | SOP8, IC SOCKET |
| CPC2-108-E-01-SG | SOP8, IC SOCKET |
| CPC2-108-E-02-SG-CU | SOP8, IC SOCKET |
| CPC2-108-E-02-SG-LDC | SOP8, IC SOCKET |
| CPC2-108-E-03-SG-CU | SOP8, IC SOCKET |
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