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參數資料
| 型號： | CPC4-128-B-SG-CU |
| 廠商： | SAMTEC INC |
| 元件分類： | 插座 |
| 英文描述： | QFP128, IC SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大小： | 113K |
| 代理商： | CPC4-128-B-SG-CU |
CPC4–128–B–SG
CPC4–064 –B–SG
High I/O
(0,64mm) .025"
pitch
Soft gold
plated Phosphor
Bronze
wire board
fingers
Metal die
attach pad
for high
conductivity
SAMTEC USA Tel: 1-800-SAMTEC-9 or 812-944-6733 Fax: 812-948-5047
SAMTEC UK Tel: 01236 739292 Fax: 01236 727113
SAMTEC ASIA PACIFIC Tel: 65-745-5955 Fax: 65-841-1502
SAMTEC GERMANY Tel: +49 (0) 89 / 89460-0 Fax: +49 (0) 89 / 89460-299
SAMTEC FRANCE Tel: 01 60 95 06 60 Fax: 01 60 95 06 61
SAMTEC ITALY Tel: 39 039 6890337 Fax: 39 039 6890315
SAMTEC JAPAN Tel: 81-424-42-8318 Fax: 81-424-42-8319
SAMTEC CHINA Tel: 86-21-5385-4089 Fax: 86-21-5385-4047
SAMTEC TAIWAN Tel: (02) 2395-1677 Fax: (02) 2395-1689
Due to technical progress, all designs, specifications and components are subject to change without notice.
FACTSHEET F-200
CPC4
NO. OF POSITIONS
OTHER
OPTION
PLATING
OPTION
–SG
= 30
" (0,76m)
Soft Gold
(.9999 pure)
–064, –128
CHIP PACKAGE CPC4 SERIES
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Leave blank for
Cavity Down
–CU
= Cavity Up
–LDC
= (1,52mm) .060"
thick cupped
lid with
(0,76mm) .030"
cavity
–LDF
= (0,76mm) .030"
thick flat lid
SPECIFICATIONS
Materials:
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Operating Temp Range:
-65
°C to +105°C with Tin;
-65
°C to +125°C with Gold
Plating:
Au over 50
"
(1,27
m) Ni
Current Rating:
Testing Now!
Max Processing Temp:
230
°C for 60 seconds
SMT Lead Coplanarity:
(0,10mm) .004" max
B
NO. OF
POSITIONS
064
128
A
(12,01)
.473
(21,67)
.853
B
(15,75)
.620
(25,40)
1.000
C
(17,88)
.704
(27,53)
1.084
A (SQ)
B (SQ)
(0,64)
.025
(0,81)
.032
C (SQ)
(0,20)
.008
(2,79)
.110
(1,65)
.065
(1,14)
.045
–CU Option
(Cavity up)
Standard Option
(Cavity down)
ALSO AVAILABLE
Optional
lids for
chip/
wire bond
protection.
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