
2003 California Micro Devices Corp. All rights reserved.
12/10/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
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CSPESD301/302/303
1,2 and 3-Channel ESD Arrays in CSP
Features
1, 2 or 3 channels of ESD protection
±15kV ESD protection (IEC 61000-4-2, contact
discharge)
±30kV ESD protection (HBM)
Supports both AC and DC signal applications
Low leakage current (<100nA)
Chip Scale Package features extremely low lead
inductance for optimum ESD and filter perfor-
mance
4 bump, 1.06 x 0.93mm footprint Chip Scale Pack-
age (CSP)
Lead-free version available
Applications
I/O port protection
EMI filtering for data ports
Cellphones, notebook computers, PDAs
Wireless Handsets
MP3 Players
Digital Still Cameras
Handheld PCs
Product Description
The CSPESD301/302/303 is a family of 1, 2, and 3-
channel ESD protection arrays, which integrate two,
three and four identical avalanche-style diodes. It is
intended that one of these diodes is connected to GND
and the other diodes provide ESD protection for up to 3
lines depending upon the configuration utilized. The
back-to-back diode connections provide ESD protec-
tion for nodes that have AC signals up to 5.9V peak.
These devices provide a very high level of protection
for sensitive electronic components that may be sub-
jected to electrostatic discharge (ESD). The diodes
are designed and characterized to safely dissipate
ESD strikes of ±15kV, well beyond the maximum
requirements of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, these devices
protection against contact discharges at greater than
±30kV. The diodes also provide some EMI filtering,
when used in combination with a PCB trace or series
resistor.
These devices are particularly well suited for portable
electronics (e.g. cellular telephones, PDAs, notebook
computers) because of their small package format and
easy-to-use pin assignments.
The CSPESD301/2/3 is available in a space-saving,
low-profile, chip-scale package with optional lead-free
finishing.
Electrical Schematics
B1
A2
B2
B1
A2
B2
B1
A2
A1
CSPESD301
CSPESD302
CSPESD303