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參數資料
型號: CSPRC032A
英文描述: EMI/RFI Filter Network. Chip Scale Package
中文描述: 的EMI / RFI濾波網絡。芯片級封裝
文件頁數: 1/5頁
文件大小: 419K
代理商: CSPRC032A
2003 California Micro Devices Corp. All rights reserved.
10/14/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
1
CSPRC032A
4 Channel EMI Filter Network
Features
4 EMI filter lines per device
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small foot print suitable for portable devices
Silicon substrate
Lead-free version available
Applications
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
Laptop computers
Product Description
The CSPRC032A is a 4-channel low pass EMI filter (R-
C-R configuration) in a Chip Scale Package (CSP).
Many portable applications require the attenuation of
signals in the 800-3000 MHz band. California Micro
Devices’ unique thin film technology provides a mini-
mum of –25dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on a FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diame-
ter.
The CSPRC032A is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Electrical Schematic
R
50
C
43pF
50
R
B1
A1
GND
R
50
C
43pF
50
R
B2
A2
GND
R
50
C
43pF
50
R
B4
A4
GND
R
50
C
43pF
50
R
B5
A5
GND
B3
GND
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相關代理商/技術參數
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