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參數(shù)資料
| 型號： | CUW676-1070-26AB95L |
| 元件分類： | 插座 |
| 英文描述： | BGA676, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 2/8頁 |
| 文件大小： | 1341K |
| 代理商： | CUW676-1070-26AB95L |
Ball / Land Grid Array Sockets
Twist Lock Type
E-tec is now the leading BGA socket manufacturer.
EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.
Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional
board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with
no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
SMT Style
PCB Pad Layout
0,60mm/.024“ if pitch 1,27mm
0,50mm/.020“ if pitch 1,00mm
0,40mm/.016“ if pitch 0,80mm
0,35mm/.014“ if pitch 0,75mm
0,35mm/.014“ if pitch 0,65mm
0,30mm/.012“ if pitch 0,50mm
You may request any specific socket dimension from
info@e-tec.com
For top view socket dimension
pls. ref. to separate catalog page
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
Pitch
ball
diameters
ball
height
min/max
0.50mm
0.25mm / 0.35mm
0.15mm / 0.30mm
0.65mm
0.25mm / 0.45mm
0.15mm / 0.30mm
0.75mm
0.25mm / 0.45mm
0.15mm / 0.40mm
0.80mm
0.40mm / 0.55mm
0.25mm / 0.45mm
1.00mm
0.50mm / 0.70mm
0.30mm / 0.50mm
1.27mm & 1.50mm
a) plastic chips (BPW)
0.60mm / 1.00mm
0.50mm / 0.70mm
b) ceramic chips (BCW)
0.60mm / 1.00mm
0.80mm / 1.00mm
If the minimum ball diameter of a given chip falls below the above
indications, then a BUW socket will generally be proposed.
Soldertail Style
Soldertail:
0,42mm/.016” if pitch 1,27mm
0,29mm/.011” if pitch 1,00mm
0,29mm/.011” if pitch 0,80mm
0,27mm/.010” if pitch 0,75mm
0,27mm/.010” if pitch 0,65mm
0,27mm/.010” if pitch 0,50mm
PCB Hole Layout
PCB solder hole:
0,60mm/.024” if pitch 1,27mm
0,50mm/.020” if pitch 1,00mm
0,40mm/.016” if pitch 0,80mm
0,35mm/.014” if pitch 0,75mm
0,35mm/.014” if pitch 0,65mm
0,35mm/.014” if pitch 0,50mm
The pitch dimension depends on your Ball Grid Array
Specifications
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
Insulator (RoHS compliant)
Terminal (RoHS compliant)
Contact (RoHS compliant)
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Capacitance
Inductance
Operating temperature
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz
to 14 oz-inch
High temp plastic or epoxy FR4
Brass
BeCu
< 100 m
Ω
500 mA max.
100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards
500V min.
< 1 pF
< 2 nH
55°C to +125°C ; 260°C for 60 sec.
Recommendations
Torque limiting screw driver
Refer to page “Tools” of this catalog
Solder paste
Please use a solder paste w/o any silver!
Solder profile
Please refer to our website www.e-tec.com
How to order
X X W x x x x - x x x x - x x X X 95 L
optional for locating pegs
Device Type
Device Material
Pitch
Grid Code Config Code
Plating
B = Ball Grid
L = Land Grid
C = Column Grid
C = std. socket for
ceramic device
P = std. socket for
plastic device
U = socket adapted to
small diameter solderballs
05 = 0,50mm
06 = 0,65mm
07 = 0,75mm
08 = 0,80mm
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
others on
request
will be given by the factory
after receipt of the chip
datasheet
95 = tin/gold
(tin leadfree)
Nbr of contacts
Contact Type
depends on
ballcount of chip
30 = standard SMT...( A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch )
29 = raised SMT..( A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch )
28 = special raised SMT - only for 1.00 & 0.80mm pitch…..... ( A“ = 4,50mm )
70 = standard solder tail……..…...….( A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch )
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