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參數資料
| 型號： | CX77314 |
| 英文描述： | CX77314 Product Summary|PA Modules for GSM/GPRS Handsets |
| 中文描述： | CX77314產品概要|功率放大器模塊的GSM / GPRS手機 |
| 文件頁數： | 1/14頁 |
| 文件大小： | 517K |
| 代理商： | CX77314 |
100956E
Skyworks Solutions, Inc. Proprietary Information
[781] 376-7000 FAX [781] 376-3100 SALES@SKYWORKSINC.COM
WWW.SKYWORKSINC.COM
1
SEPTEMBER 19, 2003
DATA SHEET
CX77301: PA Module Dual-band EGSM900 DCS1800 / GPRS
APPLICATIONS
Dual-band cellular handsets
encompassing
-
Class 4 EGSM900,
-
Class 1 DCS1800
-
up to Class 10 GPRS multi-slot
operation.
FEATURES
High efficiency
-
EGSM 55%
-
DCS 50%
Input/output matching
-
50
internal
Small outline 9.1 mm x 11.6 mm
Low profile 1.5 mm maximum
Low APC current 10
μ
A typical
The CX77301 is a dual-band Power Amplifier Module (PAM) designed in a compact form
factor for Class 4 EGSM900 and Class 1 DCS1800 operation that also supports multi-slot
transmission for Class 10 General Packet Radio Service (GPRS) operation.
The module consists of an EGSM900 PA block, a DCS1800 PA block, impedance matching
circuitry for 50
input and output impedances, and bias control circuitry. Two separate
Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated on a single Gallium
Arsenide (GaAs) die. One PA block operates in the EGSM900 band and the other PA block
supports the DCS1800 band. Optimized for lithium ion battery operation, both PA blocks
share common power supply pins to distribute current. A custom CMOS integrated circuit
provides the internal interface circuitry, including a current amplifier that minimizes the
required power control current (I
APC
) to 10
μ
A, typical. The GaAs die, the Silicon (Si) die, and
passive components are mounted on a multi-layer laminate substrate. The assembly is
encapsulated with plastic overmold.
The RF input and output ports are internally matched to 50
to reduce the number of
external components for a dual-band design. Extremely low leakage current (2
μ
A, typical)
of the dual PA module maximizes handset standby time. The CX77301 also contains band-
select switching circuitry to select EGSM (logic 0) or DCS (logic 1) as determined from the
Band Select (BS) signal. In the Functional Block Diagram shown below, the BS pin selects
the PA output (DCS OUT or EGSM OUT) while the Analog Power Control (APC) controls the
level of output power.
CMOS
Bias
Controller
EGSM IN
EGSM OUT
DCS IN
DCS OUT
Power Control
Band Select
HBT
Match
Match
Match
Match
100956_001
Figure
. Functional Block Diagram
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