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參數資料
| 型號： | CXXXXT420-SXX00-A |
| 廠商： | Cree, Inc. |
| 英文描述： | XThin㈢ LEDs |
| 中文描述： | XThin㈢發光二極管 |
| 文件頁數： | 1/4頁 |
| 文件大小： | 209K |
| 代理商： | CXXXXT420-SXX00-A |
Subject to change without notice.
www.cree.com
FEATURES
XThin LED Performance
450 nm – 24 mW min.
Low Forward Voltage
Single Wire Bond Structure
Class 2 ESD Rating
–
APPLICATIONS
LCD Backlighting
Digital Camera Flash for Mobile Appliance
LED Video Displays
Audio Product Display Lighting
XThin
LEDs
C
xxx
XT420-S
xx
00-A
Cree’s XThin LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree’s
proprietary GSiC
substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a
geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond
connection. These vertically structured LED chips are approximately 175 microns in height and require a low forward
voltage. Cree’s XT chips are tested for conformity to optical and electrical specifications and the ability to withstand
1000 V ESD. Applications for XThin LEDs include next-generation mobile appliances for use in their LCD backlights and
digital camera flash where brightness, sub-miniaturization, and low power consumption are required.
C
xxx
XT420-Sx
x0
0-A Chip Diagram
Top View
Bottom View
Die Cross Section
GSiC LED Chip
420 x 420 μm
Gold Bond Pad
105 μm Diameter
SiC Substrate
t = 175 μm
Backside
Metalization
Cathode (-)
Anode (+)
D
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