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參數(shù)資料
型號: CY62147DV30LL-45BVXI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 4-Mbit (256K x 16) Static RAM
中文描述: 256K X 16 STANDARD SRAM, 45 ns, PBGA48
封裝: 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48
文件頁數(shù): 1/12頁
文件大小: 359K
代理商: CY62147DV30LL-45BVXI
4-Mbit (256K x 16) Static RAM
CY62147DV30
Cypress Semiconductor Corporation
Document #: 38-05340 Rev. *F
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised August 31, 2006
Features
Temperature Ranges
Industrial
:
–40°C to +85°C
— Automotive-A: –40°C to +85°C
— Automotive-E: –40°C to +125°C
Very high speed: 45 ns
Wide voltage range: 2.20V–3.60V
Pin-compatible with CY62147CV25, CY62147CV30, and
CY62147CV33
Ultra-low active power
— Typical active current: 1.5 mA @ f = 1 MHz
— Typical active current: 8 mA @ f = f
max
Ultra low standby power
Easy memory expansion with CE, and OE features
Automatic power-down when deselected
CMOS for optimum speed/power
Available in Pb-free and non Pb-free 48-ball VFBGA and
non Pb-free 44-pin TSOPII
Byte power-down feature
Functional Description
[1]
The CY62147DV30 is a high-performance CMOS static RAM
organized as 256K words by 16 bits. This device features ad-
vanced circuit design to provide ultra-low active current. This
is ideal for providing More Battery Life (MoBL
) in portable
applications such as cellular telephones. The device also has
an automatic power-down feature that significantly reduces
power consumption. The device can also be put into standby
mode reducing power consumption by more than 99% when
deselected (CE HIGH or both BLE and BHE are HIGH). The
input/output pins (I/O
0
through I/O
15
) are placed in a high-im-
pedance state when: deselected (CE HIGH), outputs are dis-
abled (OE HIGH), both Byte High Enable and Byte Low Enable
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW and WE LOW).
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O
0
through I/O
7
), is
written into the location specified on the address pins (A
0
through A
17
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
8
through I/O
15
) is written into the location
specified on the address pins (A
0
through A
17
).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
0
to I/O
7
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O
8
to I/O
15
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The CY62147DV30 is available in a 48-ball VFBGA, 44 Pin
TSOPII packages.
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Logic Block Diagram
256K x 16
RAM Array
I/O
0
–I/O
7
R
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
COLUMN DECODER
A
1
A
1
A
1
A
1
A
1
S
DATA IN DRIVERS
OE
BLE
I/O
8
–I/O
15
CE
WE
BHE
A
1
A
0
A
1
A
9
Power
-
Down
Circuit
BHE
BLE
CE
A
10
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