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參數資料
| 型號： | CY7C1362A-225BGC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
| 中文描述： | 512K X 18 CACHE SRAM, 2.5 ns, PBGA119 |
| 封裝： | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
| 文件頁數： | 1/28頁 |
| 文件大小： | 572K |
| 代理商： | CY7C1362A-225BGC |
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256K x 36/512K x 18 Synchronous
Pipelined Burst SRAM
CY7C1360A
CY7C1362A
Cypress Semiconductor Corporation
Document #: 38-05258 Rev. *A
3901 North First Street
San Jose
CA 95134
408-943-2600
Revised May 24, 2002
Features
Fast access times: 2.5 ns, 3.0 ns, and 3.5 ns
Fast clock speed: 225, 200, 166, and 150 MHz
Fast OE access times: 2.5 ns, 3.0 ns, and 3.5 ns
Optimal for depth expansion (one cycle chip deselect
to eliminate bus contention)
3.3V –5% and +10% power supply
3.3V or 2.5V I/O supply
5V-tolerant inputs except I/Os
Clamp diodes to V
SS
at all inputs and outputs
Common data inputs and data outputs
Byte Write Enable and Global Write control
Multiple chip enables for depth expansion:
three chip enables for A package version and two chip
enables for BG and AJ package versions
Address pipeline capability
Address, data, and control registers
Internally self-timed Write Cycle
Burst control pins (interleaved or linear burst
sequence)
Automatic power-down feature available using ZZ mode
or CE deselect
JTAG boundary scan for BG and AJ package version
Low-profile 119-bump, 14-mm × 22-mm PBGA (Ball Grid
Array) and 100-pin TQFP packages
Functional Description
The Cypress Synchronous Burst SRAM family employs
high-speed, low-power CMOS designs using advanced
triple-layer polysilicon, double-layer metal technology. Each
memory cell consists of four transistors and two high-valued
resistors.
The CY7C1360A and CY7C1362A SRAMs integrate 262,144
×
36 and 524,288
×
18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enable (CE), depth-expansion
Chip Enables (CE
2
and CE
3
), burst control inputs (ADSC,
ADSP, and ADV), Write Enables (BWa, BWb, BWc, BWd, and
BWE), and global Write (GW). However, the CE
3
chip enable
input is only available for the TA package version.
Asynchronous inputs include the Output Enable (OE) and
burst mode control (MODE). The data outputs (Q), enabled by
OE, are also asynchronous.
Addresses and chip enables are registered with either
Address Status Processor (ADSP) or Address Status
Controller (ADSC) input pins. Subsequent burst addresses
can be internally generated as controlled by the Burst Advance
Pin (ADV).
Address, data inputs, and Write controls are registered on-chip
to initiate self-timed Write cycle. Write cycles can be one to
four bytes wide as controlled by the Write control inputs.
Individual byte Write allows individual byte to be written. BWa
controls DQa. BWb controls DQb. BWc controls DQc. BWd
controls DQd. BWa, BWb, BWc, and BWd can be active only
with BWE being LOW. GW being LOW causes all bytes to be
written. The x18 version only has 18 data inputs/outputs (DQa
and DQb) along with BWa and BWb (no BWc, BWd, DQc, and
DQd).
For the B and T package versions, four pins are used to
implement JTAG test capabilities: Test Mode Select (TMS),
Test Data-In (TDI), Test Clock (TCK), and Test Data-Out
(TDO). The JTAG circuitry is used to serially shift data to and
from the device. JTAG inputs use LVTTL/LVCMOS levels to
shift data during this testing mode of operation. The TA
package version does not offer the JTAG capability.
The CY7C1360A and CY7C1362A operate from a +3.3V
power supply. All inputs and outputs are LVTTL-compatible.
Selection Guide
7C1360A-225
7C1362A-225
2.5
650
10
7C1360A-200
7C1362A-200
3.0
620
10
7C1360A-166
7C1362A-166
3.5
530
10
7C1360A-150
7C1362A-150
3.5
480
10
Unit
ns
mA
mA
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
相關PDF資料 |
PDF描述 |
|---|---|
| CY7C1360A-150AC | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
| CY7C1360A-150AI | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
| CY7C1360A-150AJC | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
| CY7C1360A-150AJI | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
| CY7C1360A-150BGC | 256K x 36/512K x 18 Synchronous Pipelined Burst SRAM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| CY7C1362AI-200AC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1362B-166AJC | 功能描述:IC SRAM 9MBIT 166MHZ 100LQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤 |
| CY7C1362B-166BGC | 功能描述:IC SRAM 9MBIT 166MHZ 119BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤 |
| CY7C1362B-200AC | 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Single 3.3V 9M-Bit 512K x 18 3ns 100-Pin TQFP |
| CY7C1362C-166AJXC | 功能描述:靜態隨機存取存儲器 512Kx18 3.3V COM Sync PL 1CD 靜態隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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