| 型號 | 廠商 | 描述 |
| jantxv1n3007ra 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3007rb 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3007rc 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3007rd 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008a 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008b 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008c 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-2%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3008d 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008r 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008ra 2 3 4 |
MICROSEMI CORP-LAWRENCE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-2%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3008rb 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008rc 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3008rd 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009a 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009b 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3009c 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009d 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009r 2 3 4 |
MICROSEMI CORP-LAWRENCE | CAP 1000PF 100V 5% NP0(C0G) SMD-0805 TR-13-PL SN-NIBAR |
| jantxv1n3009rb 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009rc 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3009rd 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3010 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3010a 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3012rd 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 16V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013 2 3 4 |
MICROSEMI CORP-LAWRENCE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3013a 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-2%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013b 2 3 4 |
MICROSEMI CORP-LAWRENCE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-2%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013c 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3013d 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013r 2 3 4 |
MICROSEMI CORP-LAWRENCE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013ra 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3013rb 2 3 4 |
MICROSEMI CORP-LAWRENCE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 16V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3013rc 2 3 4 |
MICROSEMI CORP | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3013rd 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3014 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3014a 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3014b 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 10V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3014c 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3014d 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 16V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3014r 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·￥?????μ?μ?????°????????????μ?μ?????????a?￡°???é???o3?o???????) |
| jantxv1n3014ra 2 3 4 |
MICROSEMI CORP | CAP 0.01UF 16V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3014rb 2 3 4 |
MICROSEMI CORP-SCOTTSDALE | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |
| jantxv1n3014rc 2 3 4 |
MICROSEMI CORP | CAP 0.1UF 25V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3014rd 2 3 4 |
MICROSEMI CORP | CAP 0.1UF 16V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3015 2 3 4 |
MICROSEMI CORP-LAWRENCE | CAP 0.1UF 50V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3015a 2 3 4 |
MICROSEMI CORP-LAWRENCE | CAP 1UF 16V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3015b 2 3 4 |
MICROSEMI CORP | CAP 1UF 10V 10% NP0(C0G) SMD-0805 TR-7-PL SN-NIBAR |
| jantxv1n3015c 2 3 4 |
MICROSEMI CORP | Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 1.0pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-0.25pF; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Unmarked |