| 型號 | 廠商 | 描述 |
| fu-68sdf-810m69b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m71b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m73b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate |
| fu-68sdf-810m75b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m77b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m79b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m81b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m83b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m85b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate |
| fu-68sdf-810m89b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate |
| fu-68sdf-v810mxxb 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v810mxxxb 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m95b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m93b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m87b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m35b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate |
| fu-68sdf-810m39b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m41b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m43b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m45b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m47b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m49b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m51b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m53b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m55b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m57b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m59b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m61b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m63b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-810m65b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.55 um DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m167b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m103b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m104b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m105b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m106b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m107b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m108b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m109b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m110b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: R Failure Rate |
| fu-68sdf-v802m111b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m112b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m113b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m114b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate |
| fu-68sdf-v802m115b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m116b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.01uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate |
| fu-68sdf-v802m117b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m118b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m119b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |
| fu-68sdf-v802m134b 2 3 4 5 |
Mitsubishi Electric Corporation | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 0.015uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate |
| fu-68sdf-v802m135b 2 3 4 5 |
Mitsubishi Electric Corporation | 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) |