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參數資料
| 型號： | DF3-3S-2V |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 512B RAM 38-TSSOP -40 to 105 |
| 中文描述： | 2毫米間距連接器的離散線連接（產品通過UL CSA標準批準） |
| 文件頁數： | 2/12頁 |
| 文件大小： | 417K |
| 代理商： | DF3-3S-2V |
A265
1.
Recommended Temperature Profile (SMT)
2.
Recommended Manual Soldering Condition (SMT)
3.
Recommended Screen Thickness (SMT)
4. Board Warpage
(
SMT
)
5.
Recommended Soldering Condition
(
DIP
)
6. Cleaning Condition
7. Connection Condition
Note1: Maximum twice action is allowed under the same condition. However, the interval between
the first and second actions must be maintained at room temperature.
Note2: The temperature indicates the board surface temperature on the connector lead area.
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
0.15
to
0.2mm
Based on both connector edges, 0.03mm max. in the connector center portion
I
Flow Condition with Automatic Soldering Tool. Soldering temperature: 250
±
5
, Soldering time: Within 3 seconds
I
Manual Soldering Condition. Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
Refer to the "Nylon Connector Use Hand book".
Refer to the "Nylon Connector Use Hand book".
B
Precautions
B
Embossed Carrier Tape Dimensions
Unit: mm
Product Type
Size
Number of Contacts
A
B
C
D
DF3/3D-
*
P-2H
2
to
4
5
to
7
8
to
12
13
to
15
24
32
44
56
–––
28.4
40.4
52.4
11.5
14.2
20.2
26.2
24.4
32.4
44.4
56.4
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| DF3-4P-2A | 16-bit Ultra-Low-Power Microcontroller, 16kB Flash, 512B RAM 38-TSSOP -40 to 85 |
| DF3-4P-2C | 16-bit Ultra-Low-Power Microcontroller, 16kB Flash, 512B RAM 38-TSSOP -40 to 85 |
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