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參數資料
型號: DF30FC-60DP-0.4V
廠商: Hirose Electric USA, INC.
英文描述: 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
中文描述: 0.4 mm間距,0.9毫米高,板對板/板對FPC連接器
文件頁數: 1/11頁
文件大小: 865K
代理商: DF30FC-60DP-0.4V
1
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DF30 Series
2004.10
I
Overview
Continuous miniaturization and increased component
density on PCB created demand for extremely low profile
connectors. This series is addition of a new extremely low
profile connectors to Hirose's wide range of high reliability
board-to-board/board-to-FPC connection solutions.
I
Features
1. Contact reliability
Concentration of the contact's normal forces at the single
point assures good contact wipe and electrical reliability,
while confirming the fully mated condition with a definite
tactile click.
2. Self alignment
Recognizing the difficulties of mating extremely small
connectors in limited spaces the connectors will self align
in horizontal axis within 0.3 mm.
3. Automatic board placement
Packaged on tape-and-reel the plug and headers have
sufficiently large flat areas to allow pick-up with vacuum
nozzles of automatic placement equipment.
4. Variety of contact positions and styles
Available in standard contact positions of: 20, 22, 24, 30,
34, 40, 50, 60, 70 and 80 with and without metal fittings.
Addition of metal fittings does not affect external
dimensionsof the connectors.
Smaller contact positions are also available.
5. Support for continuity test connector
Connectors which have increased insertion and removal
durability are available for continuity tests. Contact your
Hirose sales representative for details.
I
Applications
Cellular phones, PDA's, mobile computers, digital
cameras, digital video cameras, and other devices
demanding high reliability connections in extremely
limited spaces.
Extremely small size
40 positions shown
(376
(456
(0.90)
Header
Receptacle
(0.40)
(10.22)
I
Low profile
I
Increased mated retention
I
High contact reliability
DF30*-*DS-0.4V
Protrusion improves mated retention
Receptacle
0.9mm
DF30*-*DP-0.4V
Header
Self alignment
0.3mm
相關PDF資料
PDF描述
DF30FC-70DP-0.4V 0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DL-5528-1625-FS 1625 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH RECEPTACLE
DL-5528-1625-S 1625 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH RECEPTACLE
DL-5528-1625-SB 1625 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH RECEPTACLE
DL-5528-1625-SBS 1625 nm DFB LASER DIODE MODULES UNCOOLED MQW DFB LD WITH RECEPTACLE
相關代理商/技術參數
參數描述
DF30FC-60DS-0.4V 制造商:HRS 制造商全稱:HRS 功能描述:0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DF30FC-60DS-0.4V(81) 功能描述:板對板與夾層連接器 60P DR RECEP STR SMT NO MTL FIT W/O BOSS RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A
DF30FC-60DS-0.4V(82) 功能描述:板對板與夾層連接器 60P DR SMT RECEPT W/O FITTING W/O BOSS RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A
DF30FC-70DP-0.4V 制造商:HRS 制造商全稱:HRS 功能描述:0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
DF30FC-70DP-0.4V(81) 功能描述:板對板與夾層連接器 70P DR HDR STR SMT NO MTL FIT W/O BOSS RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A
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