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參數(shù)資料
| 型號： | DF9-23P-1V |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1) |
| 中文描述： | 1mm間距表面貼裝板對板連接器（標準接口連接器兼容與VESA FPDI - 1） |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 275K |
| 代理商： | DF9-23P-1V |
A285
B
Precautions for Use
1.
Recommended Temperature Profile (SMT)
Note 1 :
Maximum twice action is allowed under the same condition. However, the interval between
the first process and second actions must be maintained at the room temperature.
Note 2 : The temperature indicates the board surface temperature in the connector lead area.
2.
Recommended Manual Soldering Condition (SMT)
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
3. Recommended Screen Thickness (SMT)
0.15mm
4. Board Warp(SMT)
Maximum 0.03mm in the connector center area, based on both connector edges.
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
6. Cautions
I
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
I
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
I
Excessive scoop insertion or extraction may result in damage.
I
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
I
The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
Temperature
Time
Maximum
Preheating area
Soldering area
IR reflow condition
Preheating area 150
for 100 to 120 seconds
Soldering area
235±5
for 10 seconds max.
220
Min for 10 to 30 second
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DF9-23P-1V(20) | 功能描述:板對板與夾層連接器 Obsolete RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF9-23P-1V(32) | 功能描述:板對板與夾層連接器 1.0MM V SMT HEADER 23P TIN PLATING RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF9-23P-1V(54) | 制造商:Hirose 功能描述:CONN HEADER 23POS 1MM SMD GOLD |
| DF9-23P-1V(69) | 功能描述:板對板與夾層連接器 1.0MM V SMT HEADER 23P GOLD PLATING RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| DF9-23S-1V | 制造商:HRS 制造商全稱:HRS 功能描述:1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1) |
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