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參數資料
| 型號： | DF9C-9S-1V |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 1mm Pitch SMT Board to Board Connector(Standard Interface Connector Compliant with VESA FPDI-1) |
| 中文描述： | 1mm間距表面貼裝板對板連接器（標準接口連接器兼容與VESA FPDI - 1） |
| 文件頁數： | 8/8頁 |
| 文件大小： | 275K |
| 代理商： | DF9C-9S-1V |
A285
B
Precautions for Use
1.
Recommended Temperature Profile (SMT)
Note 1 :
Maximum twice action is allowed under the same condition. However, the interval between
the first process and second actions must be maintained at the room temperature.
Note 2 : The temperature indicates the board surface temperature in the connector lead area.
2.
Recommended Manual Soldering Condition (SMT)
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
3. Recommended Screen Thickness (SMT)
0.15mm
4. Board Warp(SMT)
Maximum 0.03mm in the connector center area, based on both connector edges.
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
6. Cautions
I
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
I
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
I
Excessive scoop insertion or extraction may result in damage.
I
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
I
The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
Temperature
Time
Maximum
Preheating area
Soldering area
IR reflow condition
Preheating area 150
for 100 to 120 seconds
Soldering area
235±5
for 10 seconds max.
220
Min for 10 to 30 second
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