
e
3
DS30516 Rev. 4 - 2
1 of 3
DFLS240L
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
DFLS240L
2.0A LOW VF SCHOTTKY BARRIER RECTIFIER
PowerDI
123
B
A
A
C
E
L4
L
L1
E
H
D
L3
L2
L
Mechanical Data
Case: PowerDI 123
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Last Page
Weight: 0.01 grams (approx.)
Ordering Information: See Last Page
Maximum Ratings
@ T
A
= 25 C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
N
Characteristic
Symbol
V
(BR)R
Min
40
Typ
Max
Unit
V
Test Condition
I
R
= 500 A
I
F
= 1.0A
I
F
= 2.0A
I
F
= 3.0A
V
R
= 40V
V
R
= 40V, T
J
= 85 C
V
R
= 20V
V
R
= 20V, T
J
= 85 C
V
R
= 10V, f = 1.0MHz
Reverse Breakdown Voltage (Note 4)
Forward Voltage
V
F
0.4
0.45
0.50
0.45
0.50
0.65
0.5
25
0.15
18
V
Leakage Current (Note 4)
I
R
mA
Total Capacitance
C
T
55
pF
PowerDI 123
Min
3.65
2.775
1.750
0.955
0.95
0.15
0.60
—
—
—
0.95
All Dimensions in mm
Dim
A
B
C
D
E
H
L
L1
L2
L3
L4
Max
3.75
2.825
1.800
1.000
1.05
0.25
0.70
—
—
—
1.25
Typ
3.70
2.80
1.775
0.98
1.00
0.20
0.65
1.36
1.10
0.20
1.05
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
Value
Unit
40
V
28
2.0
V
A
I
FSM
50
A
Features
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 5)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
@ T
A
= 25°C unless otherwise specified
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical R
JS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. Short duration pulse test to minimize self-heating effect.
5. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7
Characteristic
Symbol
P
D
P
D
R
JA
R
JA
R
JS
T
j
T
STG
Typ
Max
1.67
556
Unit
W
mW
°C/W
C/W
°C/W
C
°C
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range (See figure 4)
Storage Temperature Range
60
180
5
-55 to +125
-55 to +150
Thermal Characteristics
Electrical Characteristics