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參數(shù)資料
| 型號： | DG184 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | High-Speed Drivers and Dual DPST JFET Switches |
| 中文描述： | 高速驅(qū)動器和雙DPST能夠結(jié)型場效應(yīng)管開關(guān) |
| 文件頁數(shù)： | 8/9頁 |
| 文件大小： | 75K |
| 代理商： | DG184 |
8
DG181 Series
D16.3
MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.840
-
21.34
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
α
aaa
0.005
90
o
-
0.13
90
o
-
7
105
o
105
o
-
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
16
16
8
Rev. 0 4/94
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
PLANE
BASE
PLANE
D
S
S
-D-
-A-
-C-
e
A
-B-
aaa
C A - B
M
D
S
S
ccc
C A - B
M
D
S
S
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
METAL
LEAD FINISH
e
A/2
S2
M
A
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
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PDF描述 |
|---|---|
| DG185 | High-Speed Drivers and Dual DPST JFET Switches |
| DG190 | High-Speed Drivers with Dual SPDT JFET Switches |
| DG191 | High-Speed Drivers with Dual SPDT JFET Switches |
| DG184AP | High-Speed Drivers with JFET Switch |
| DG184BP | LED 3MM SUP RED 6LDS REAR PNLMT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DG184AK | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Interface IC |
| DG184AL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Interface IC |
| DG184AL/883 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DPST Analog Switch |
| DG184AL/883B WAF | 制造商:Harris Corporation 功能描述: |
| DG184AP | 功能描述:模擬開關(guān) IC SPST Analog Switch RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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