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All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
89 mils x 99 mils x 12 mils
METALLIZATION:
Type: Al
Thickness: 10k
±
1k
PASSIVATION:
Type: PSG Over Nitride
PSG Thickness: 7k
±
1.4k
Nitride Thickness: 8k
±
1.2k
WORST CASE CURRENT DENSITY:
1 x 10
5
A/cm
2
Metallization Mask Layouts
DG300A
DG301A
DG303A
PIN 2
D1
PIN 4
S1
PIN 7
GND
PIN 9
IN 2
PIN 13
D2
PIN 14
V+
PIN 11
S2
PIN 8
V-
NC
PIN 6
IN 1
PIN 2
D1
PIN 4
S1
PIN 13
D2
PIN 14
V+
PIN 11
S2
PIN 6
IN 1
PIN 7
GND
PIN 8
V-
NC
PIN 2
S3
PIN 4
D1
PIN 9
IN 2
PIN 14
V+
PIN 12
D4
PIN 11
D2
PIN 6
IN 1
PIN 3
D3
PIN 5
S1
PIN 10
S2
PIN 13
S4
PIN 7
GND
PIN 8
V-
NC
DG300A, DG301A, DG303A