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參數資料
| 型號： | DPS1MX8MKN3-30M |
| 英文描述： | x8 SRAM Module |
| 中文描述： | x8的SRAM模塊 |
| 文件頁數： | 1/8頁 |
| 文件大小： | 746K |
| 代理商： | DPS1MX8MKN3-30M |
16 Megabit High Speed CMOS SRAM
DPS1MX16MKn3
DESCRIPTION:
The DPS1MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.269 inches.
The DPS1MX16MKn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and
military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
Organizations Available:
1Meg x 16 or 2 Meg x 8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage: 2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
*
Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
Address Inputs
Data Input/Output
Low Chip Enables
Write Enable
Output Enables
Power (+5V)
Ground
No Connect
A0 - A18
I/O0 - I/O15
CE0 - CE3
WE
OE0, OE1
V
DD
V
SS
N.C.
Gullwing
Leaded
Stack
‘’J’’ Leaded
Stack
SLCC Stack
Straight
Leaded
Stack
This document contains information on a product that is currently released
30A129-04
REV. E
1
This Material Copyrighted By Its Respective Manufacturer
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相關代理商/技術參數 |
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| DPS1MX8MKN3-35C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SRAM Module |
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| DPS1MX8MKN3-35M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SRAM Module |
| DPS1MX8MKN3-45B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SRAM Module |
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