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參數資料
| 型號： | DPS256S8P-70C |
| 英文描述： | x8 SRAM Module |
| 中文描述： | x8的SRAM模塊 |
| 文件頁數： | 1/10頁 |
| 文件大小： | 839K |
| 代理商： | DPS256S8P-70C |
4 Megabit High Speed CMOS SRAM
DPS256X16Cn3/DPS256X16Bn3
DESCRIPTION:
The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ‘’STACK’’
modules are a revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages,
or mounted on a 50-pin PGA co-fired ceramic substrate. The module
packs 4-Megabits of low-power CMOS static RAM in an area as small
as 0.463 in2, while maintaining a total height as low as 0.349 inches.
The DPS256X16Cn3/DPS256X16Bn3 STACK modules contain four
individual 128K x 8 SRAMs, each packaged in a hermetically sealed
SLCC, making the modules suitable for commercial, industrial and
military applications.
The DPS256X16Bn3 has one active low Chip Enable (CE) and while
the DPS256X16Cn3 an active low Chip Enable (CE) and an active high
Select Line (SEL).
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
Organizations Available: 256Kx16 or 512Kx8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation - No clock or refresh required
Single +5V Power Supply, ±10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage: 2.0V min.
Packages Available:
48 - Pin SLCC Stack
48 - Pin Straight Leaded Stack
48 - Pin ‘’J’’ Leaded Stack
48 - Pin Gullwing Leaded Stack
50 - Pin PGA Dense-Stack
* Commercial only.
Gullwing
Leaded Stack
‘’J’’ Leaded
Stack
Dense-Stack
SLCC Stack
Straight Leaded
Stack
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
30A097-34
REV. G
1
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| DPS256S8PL-12C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 SRAM Module |
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