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參數(shù)資料
| 型號(hào)： | DPZ256X32IV325I |
| 英文描述： | x32 Flash EEPROM Module |
| 中文描述： | X32號(hào)，閃存EEPROM模塊 |
| 文件頁數(shù)： | 1/14頁 |
| 文件大?。?/td> | 992K |
| 代理商： | DPZ256X32IV325I |
8 Megabit FLASH EEPROM
DPZ256X32IV3
DESCRIPTION:
The DPZ256X32IV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers
8 Megabits of FLASH EEPROM in a single package
envelope of 1.090" x 1.090" x .252".
The DPZ256X32IV3 is built with four SLCC packages
each containing two 128K x 8 FLASH memory devices.
Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules
offers a higher board density of memory than available
with conventional through-hole, surface mount, module
or hybrid techniques.
FEATURES:
Organization:
256K x 32, 512K x 16
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation
- No clock or refresh required
TTL Compatible Inputs
and Outputs
Common Data Inputs
and Outputs
10,000 Erase/Program
Cycles (min.)
66 - Pin PGA ‘’VERSA-STACK’’
Package
PIN-OUT DIAGRAM
PIN NAMES
Address Inputs
I/O0 - I/O31
CE0 - CE3
WE0, WE1
OE
A0 - A16
Data Input/Output
Chip Enables
Write Enables
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
V
PP
V
DD
V
SS
N.C.
FUNCTIONAL BLOCK DIAGRAM
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
30A072-11
REV. A
1
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