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參數資料
| 型號： | DPZ512X16IA3-15C |
| 英文描述： | x16 Flash EEPROM Module |
| 中文描述： | x16閃存EEPROM模塊 |
| 文件頁數： | 1/16頁 |
| 文件大小： | 1185K |
| 代理商： | DPZ512X16IA3-15C |
8 Megabit FLASH EEPROM
DPZ512X16In3
DESCRIPTION:
The DPZ512X16In3 ‘’STACK’’ modules are a revolutionary new
memory subsystem using Dense-Pac Microsystems’ ceramic
Stackable Leadless Chip Carriers (SLCC). Available in straight
leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a
50-pin PGA co-fired ceramic substrate. The module packs
8-Megabits of FLASH EEPROM in an area as small as 0.463 in
2
,
while maintaining a total height as low as 0.349 inches.
The DPZ512X16In3 STACK modules contain four individual SLCC
packages each containing two 128K x 8 FLASH memory devices.
Each SLCC is hermetically sealed making the module suitable for
commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
Organization:
512K x 16 or 1 Meg x 8
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation - No clock or refresh required
TTL Compatible Inputs and Outputs
Common Data Inputs and Outputs
10,000 Erase/Program Cycles (min.)
Packages Available:
48 - Pin SLCC Stack
48 - Pin Straight Leaded Stack
48 - Pin ‘’J’’ Leaded Stack
48 - Pin Gullwing Leaded Stack
50 - Pin PGA Dense-Stack
DPZ512X16IH3
DPZ512X16IJ3
DPZ512X16IA3
DPZ512X16IY3
DPZ512X16II3
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
30A071-11
REV. E
1
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相關PDF資料 |
PDF描述 |
|---|---|
| DPZ512X16IA3-15I | x16 Flash EEPROM Module |
| DPZ512X16IA3-15M | x16 Flash EEPROM Module |
| DPZ512X16IA3-17B | x16 Flash EEPROM Module |
| DPZ512X16IA3-17C | x16 Flash EEPROM Module |
| DPZ512X16IA3-17I | x16 Flash EEPROM Module |
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