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參數資料
| 型號： | DS1624S+T&R |
| 廠商： | Maxim Integrated |
| 文件頁數： | 13/18頁 |
| 文件大小： | 424K |
| 描述： | IC THERM/EEPROM DIG 256BYT 8SOIC |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,000 |
| 功能： | 溫度計，恒溫計 |
| 傳感器類型： | 內部 |
| 感應溫度： | -55°C ~ 125°C |
| 精確度： | ±0.5°C（最小值） |
| 拓撲： | EEPROM，寄存器庫 |
| 輸出類型： | 2 線串行 |
| 輸出警報： | 無 |
| 輸出風扇： | 無 |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.209"，5.30mm 寬） |
| 供應商設備封裝： | 8-SO |
| 包裝： | 帶卷 (TR) |
DS1624
1 f 1
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground ................................................................................... -0.5V to +6.0V
Continuous Power Dissipation (T
A
= +70癈)
PDIP (derate 9.10mW/癈 above +70癈) ................................................................................................. 727.30mW
Operating Temperature Range .......................................................................................................... -55癈 to +125癈
Storage Temperature Range ............................................................................................................. -55癈 to +125癈
Soldering Temperature (reflow) ...................................................................................................................... +260癈
Lead Temperature (soldering, 10s) .................................................................................................................. +300癈
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device
reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PDIP
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) .......................... 110癈/W
Junction-to-Case Thermal Resistance (?/DIV>
JC
) ................................ 40癈/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
YMB L
MI
TYP
MAX
IT
TE
l
l
2
1
DC ELECTRICAL CHARACTERISTICS
(V
DD
= 2.7V to 5.5V, T
A
= -55癈 to +125癈, unless otherwise noted.) (Note 12)
PARAMETER
YMB L
DITI
MI
TYP
MAX
IT
TE
Thermometer Error
T
ERR
0癈 to +70癈
?.5
癈
10
-55癈 to +125癈
?.0
Thermometer Resolution
12-bit
0.0625
癈
Low Level Input Voltage
V
IL
-0.3
0.3V
DD
V
High Level Input Voltage
V
IH
0.7V
DD
V
DD
+
0.3
V
Pulse Width of Spikes
That Must Be Suppressed
h In Fil r
t
SP
Fast mode
0
50
ns
Low Level Output
Volta e SDA
V
3mA sink current
0
0.4
V
1
V
6mA sink current
0
0.6
V
1
Input Current Each I/O
Pin
0.4 < V
I/O
<
-1
+1
礎
2
I/O Ca acitance
C
10
F
Active Supply Current
I
CC
Temperature
n r i n
1250
E
2
write
400
A
3 4
Communication
nl
125
Standby Supply Current
I
STBY
1
3
礎
3, 4, 5
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