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參數(shù)資料
| 型號(hào)： | DS21Q352DK |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 1/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | KIT DESIGN FOR DS21Q352 |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 電信，調(diào)幀器和線路接口裝置（LIU） |
| 已用 IC / 零件： | DS21Q352 |
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DALLAS SEMICONDUCTOR
Preliminary
Quad T1/E1 Transceiver (5V)
Quad T1/E1 Transceiver (3.3V)
DS21Q552/DS21Q554
DS21Q352/DS21Q354
December 29, 1998
FEATURES
P
Four (4) Completely Independent T1 or E1 Transceivers
In One Small 27mm x 27mm Package
Each Transceiver Contains a Short & Long Haul Line Interface
Plus a Full Featured Framer with Alarm Detection/Generation,
Elastic Stores, Hardware Based Signaling Support, Per DS0
Channel Control and HDLC Controller
Each Multi-Chip Module (MCM) Contains Four Die of:
DS21352 (DS21Q352)
DS21552 (DS21Q552)
DS21354 (DS21Q354)
DS21554 (DS21Q554)
Selection Guide:
Supply
Device
T1
3.3V
DS21Q352
T1
5V
DS21Q552
E1
3.3V
DS21Q354
E1
5V
DS21Q554
See the Specific DS21352/DS21552 and DS21354/DS21554
Data Sheets for Details on their Feature Set and Operation
All Four T1 or E1 Transceivers Can be Concatenated into a Single
8.192MHz Backplane Data Stream
IEEE 1149.1 JTAG-Boundary Scan Architecture
DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible
to Allow the Same Footprint to Support T1 and E1 Applications
256–lead MCM BGA package (27mm X 27mm)
Low Power 5V CMOS or Low Power 3.3V CMOS with 5V
Tolerant Input & Outputs
DESCRIPTION
The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the
DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.
Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical
connections as shown in Figure 1.
All of the functions available on the DS21352/DS21552 and
DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package
size, some signals have been deleted. These differences are detailed in Table 1.
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the
DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the
operating characteristics of the device.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS21Q352N | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V Quad T1/E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q354 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V Quad T1/E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q354B | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V Quad T1/E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q354B+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V Quad T1/E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q354BN | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V Quad T1/E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
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