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參數資料
| 型號： | DSPIC33FJ32MC204T-I/ML |
| 廠商： | Microchip Technology |
| 文件頁數： | 5/76頁 |
| 文件大小： | 0K |
| 描述： | IC DSPIC MCU/DSP 32K 44QFN |
| 產品培訓模塊： | Asynchronous Stimulus |
| 標準包裝： | 1,600 |
| 系列： | dsPIC™ 33F |
| 核心處理器： | dsPIC |
| 芯體尺寸： | 16-位 |
| 速度： | 40 MIP |
| 連通性： | I²C，IrDA，LIN，SPI，UART/USART |
| 外圍設備： | 欠壓檢測/復位，DMA，電機控制 PWM，QEI，POR，PWM，WDT |
| 輸入/輸出數： | 35 |
| 程序存儲器容量： | 32KB（32K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 3 V ~ 3.6 V |
| 數據轉換器： | A/D 9x10b/12b |
| 振蕩器型： | 內部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 44-VQFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
| 配用： | DV164033-ND - KIT START EXPLORER 16 MPLAB ICD2 DM240001-ND - BOARD DEMO PIC24/DSPIC33/PIC32 |
| 其它名稱： | DSPIC33FJ32MC204T-I/MLTR |
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2007-2012 Microchip Technology Inc.
DS70283K-page 13
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJ32MC202/204 and
dsPIC33FJ16MC304 family of 16-bit Digital Signal
Controllers (DSCs) requires attention to a minimal set
of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
All VDD and VSS pins
All AVDD and AVSS pins (even if the ADC module is
not used)
VCAP
MCLR pin
PGECx/PGEDx pins used for In-Circuit Serial
Programming (ICSP) and debugging purposes
(see Section 2.5 “ICSP Pins”)
OSC1 and OSC2 pins when external oscillator
source is used
Additionally, the following pins may be required:
VREF+/VREF- pins used when external voltage
reference for ADC module is implemented
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: Recommendation
of 0.1 F (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 F in parallel with 0.001 F.
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ32MC202/204 and
dsPIC33FJ16MC304 family of devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
this data sheet for device-specific register
and bit information.
Note:
The AVDD and AVSS pins must be
connected independent of the ADC
voltage reference source.
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| dsPIC33FJ32MC302-E/MM | 功能描述:數字信號處理器和控制器 - DSP, DSC 16B MCU/DSP 28 LD 40MIPS 32 KB FLASH RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| dsPIC33FJ32MC302-E/SO | 功能描述:數字信號處理器和控制器 - DSP, DSC 16B DSC 28LD32KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| dsPIC33FJ32MC302-E/SP | 功能描述:數字信號處理器和控制器 - DSP, DSC 16B DSC 28LD32KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| dsPIC33FJ32MC302-I/MM | 功能描述:數字信號處理器和控制器 - DSP, DSC 16B MCU/DSP 28 LD 40MIPS 32 KB FLASH RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| dsPIC33FJ32MC302-I/SO | 功能描述:數字信號處理器和控制器 - DSP, DSC 16B DSC 28LD32KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
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