項目

內容

常規(guī)

特殊

1

層數

no.of layer

1～6層

8層

2

完成板尺寸(最大)

finished board siae (max)

250*650mm

ok

3

完成板尺寸(最小)

finished board siae (min)

8mm*12mm

ok

4

板厚度(最大)

board thickness (max)

23 mil (0.6mm)

ok

5

板厚度(最小)

board thickness (min)

3 mil (0.0765mm)

（防焊）0.05mm

6

成品厚度公差(0.085mm≦板厚<0.4mm)

fineshed board thickness folerance

 (0.085mm≦board thickness<0.4mm)

±2mil(±0.05m)

ok

7

鉆孔孔徑(最大)

drill hole diameter (max)

240 mil (6.0mm)

6.5mm

8

鉆孔孔徑(最小)

drill hole diameter (min)

8 mil (0.20mm)

0.15mm

9

外形精度

±0.1mm

±0.05mm

10

完成孔徑(最小) for machine drill

fineshed via diameter (min)

6 mil (0.15mm)

0.10mm

11

底銅厚度(最小)

outer layer base copper thickness (min)

1/2oz(18um)

1/3oz

12

底銅厚度(最大)

outer layer base copper thickness (max)

2oz(72um)

3oz

13

絕緣層厚度(最小)

inner layer dielectric thickness (min)

0.0127mm(pi厚1/2mil)

ok

14

絕緣層厚度(最大)

inner layer dielectric thickness (max)

0. 50mm(pi厚2mil)

ok

15

材料類型

base.material

pi聚酰亞胺/pet聚脂

無膠基材

16

孔電鍍縱橫比(最大)

hole plating aspect ratio (max)

5:1

ok

17

孔徑公差(鍍通孔)

hole diameter tolerance (pth)

±3mil(±0.076 mm)

ok

18

鉆孔孔徑公差(非鍍通孔)

hole diameter tolerancg (npth)

±2mil(±0.050mm)

ok

19

孔位公差(與cad數相比)

hole position toleramce (compared with cad data)

±1mil(±0.025mm)

ok

20

pth孔孔壁銅厚

pth hole copper thickness

≧0.5mil(≧12.5um)

≦1.0mil(≦25 um)

≧8.0um