| 品牌 | 勝泰 | 樹脂膠分類 | 環氧樹脂 |
| 型號 | t-5829 | 粘合材料 | 電子元件 |
t-5829 technical data sheet
one component epoxy surface mount adhesive
單組分環氧樹脂貼片膠
product description產品介紹
t-5829 surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by pin transfer method. it has following features.t-5829 貼片膠用于在針轉移法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.
l low moisture absorption潮氣吸收率低
l excellent green/wet strength極佳的未固化/濕強度
l high dot profile and resists slumping and stringing極好的點狀外觀，抗流淌和拉絲
l broad equipment capability with high-volume screen printing滿足大體積絲網印刷的設備通用性
properties of uncured material固化前材料性能
property 性能 | test method 測試方法 | t-5829 |
color/appearance顏色/外觀 | visual | viscous red gel粘稠紅色凝膠 |
specific gravity密度, g/cc, | astm d-792 | 1.21 |
viscosity粘度, (cp), 25℃ | astm d-2393 | ~20,000 |
yield strength屈服強度,cone & plate, pa, 25°c |
| 200-300 |
typical properties of cured material固化后材料典型物理性能
property性能 | test method測試方法 | value數值 |
coefficient of thermal expansion熱膨脹系數, cte | astm d696 | 140 e-06 |
thermal conductivity熱導率, w/m-k | astm c177 | 0.4 |
lap shear strength搭接剪切強度, steel鋼, mpa |
| 28 |
torque strength扭轉強度, fr4 pcb, n.mm |
| 50 - 80 |
volume resistivity體電阻系數, ohms-cm | astm d-257 | 2.1 e+15 |
surface resistivity表面電阻系數, ohms | astm d-257 | 2.0 e+15 |
dielectric constant電介質常數 | astm d150 | 3.7(1 khz), 3.6(10 khz) |
torque retention 30 seconds @100°c+3 seconds @260°cflux and wave solder波峰焊中30秒@100°c+3秒@260°c的扭力保持 |
| 100 % |
hot solder dip @260°c熱浸焊@260°c |
| pass通過 |
directions for use使用方法
typical curing condition典型固化條件: 3 min. at 150 ºc在150 ºc下保持3分鐘
curing starts above 100 ºc, with a dsc conversion of 90%, 5 min. at 125 ºc.固化開始于100 ºc以上,在125 ºc保溫5分鐘,熱轉換為90%.
cleaning清除
uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(ipa) or mek.未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除
storageinformation保存方法
在5 ºc下密封干燥儲存,保質期為6個月