| 元器件型號 | 廠商 | 描述 | 數量 | 價格 |
|---|---|---|---|---|
| C2012X7R1V225M/SOFT | TDK Corporation | CAP CER 2.2UF 35V 20% X7R 0805 | 2,000 | 2,000:$0.11400 4,000:$0.10700 10,000:$0.10100 14,000:$0.09800 50,000:$0.08800 100,000:$0.08200 |
| C2012X7R1H105M/SOFT | TDK Corporation | CAP CER 1UF 50V 20% X7R 0805 | 7,267 | 1:$0.50000 10:$0.47900 100:$0.23250 250:$0.19316 500:$0.17528 1,000:$0.16097 |
| C2012X7R1H105M/SOFT | TDK Corporation | CAP CER 1UF 50V 20% X7R 0805 | 4,000 | 2,000:$0.11400 4,000:$0.10700 10,000:$0.10000 14,000:$0.09800 50,000:$0.09300 100,000:$0.08900 |
| CGA5H2C0G1H223J | TDK Corporation | CAP CER 0.022UF 50V 5% NP0 1206 | 5,570 | 1:$0.50000 10:$0.44100 100:$0.22050 250:$0.17640 500:$0.16066 1,000:$0.14490 |
| CGA5H2C0G1H223J | TDK Corporation | CAP CER 0.022UF 50V 5% NP0 1206 | 4,000 | 2,000:$0.11340 4,000:$0.10710 10,000:$0.10080 14,000:$0.09765 50,000:$0.08820 100,000:$0.08190 |
| 類別: | 電容器 |
|---|---|
| 電容: | 2.2µF |
| 電壓 - 額定: | 35V |
| 容差: | ±20% |
| 溫度系數: | X7R |
| 安裝類型: | 表面貼裝，MLCC |
| 工作溫度: | -55°C ~ 125°C |
| 應用: | Boardflex 敏感 |
| 額定值: | - |
| 封裝/外殼: | 0805（2012 公制） |
| 尺寸/尺寸: | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 高度 - 座高（最大）: | - |
| 厚度: | |
| 厚度（最大）: | 0.057"（1.45mm） |
| 引線間隔: | - |
| 特點: | 軟端子 |
| 包裝: | 帶卷 (TR) |
| 故障率: |