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參數(shù)資料
型號(hào): EP4CGX30CF19C7N
廠商: Altera
文件頁(yè)數(shù): 13/42頁(yè)
文件大小: 0K
描述: IC CYCLONE IV FPGA 30K 324-FBGA
產(chǎn)品培訓(xùn)模塊: Cyclone IV FPGA Family Overview
特色產(chǎn)品: Cyclone? IV FPGAs
標(biāo)準(zhǔn)包裝: 84
系列: CYCLONE® IV GX
LAB/CLB數(shù): 1840
邏輯元件/單元數(shù): 29440
RAM 位總計(jì): 1105920
輸入/輸出數(shù): 150
電源電壓: 1.16 V ~ 1.24 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 324-LBGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
其它名稱: 544-2729
1–20
Chapter 1: Cyclone IV Device Datasheet
Switching Characteristics
December 2013
Altera Corporation
PLD-Transceiver Interface
Interface speed
(F324 and smaller
package)
25
125
25
125
25
125
MHz
Interface speed
(F484 and larger
package)
25
156.25
25
156.25
25
156.25
MHz
Digital reset pulse
width
Minimum is 2 parallel clock cycles
Notes to Table 1–21:
(1) This specification is valid for transmitter output jitter specification with a maximum total jitter value of 112 ps, typically for 3.125 Gbps SRIO and XAUI
protocols.
(2) The minimum reconfig_clk frequency is 2.5 MHz if the transceiver channel is configured in Transmitter Only mode. The minimum reconfig_clk frequency
is 37.5 MHz if the transceiver channel is configured in Receiver Only or Receiver and Transmitter mode.
(3) The device cannot tolerate prolonged operation at this absolute maximum.
(4) The rate matcher supports only up to ±300 parts per million (ppm).
(5) Supported for the N148, F169, and F324 device packages only.
(6) Supported for the F484, F672, and F896 device packages only. Pending device characterization.
(7) To support CDR ppm tolerance greater than ±300 ppm, implement ppm detector in user logic and configure CDR to Manual Lock Mode.
(8) Asynchronous spread-spectrum clocking is not supported.
(9) For the EP4CGX30 (F484 package only), EP4CGX50, and EP4CGX75 devices, the CDR ppl tolerance is ±200 ppm.
(10) Time taken until pll_locked goes high after pll_powerdown deasserts.
(11) Time that the CDR must be kept in lock-to-reference mode after rx_analogreset deasserts and before rx_locktodata is asserted in manual mode.
(12) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode (Figure 1–2), or after rx_freqlocked signal goes high in
automatic mode (Figure 1–3).
(13) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode.
(14) Time taken to recover valid data after the rx_freqlocked signal goes high in automatic mode.
(15) To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
Table 1–21. Transceiver Specification for Cyclone IV GX Devices (Part 4 of 4)
Symbol/
Description
Conditions
C6
C7, I7
C8
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
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參數(shù)描述
EP4CGX30CF19C8 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV GX 1840 LABs 150 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CGX30CF19C8N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV GX 1840 LABs 150 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CGX30CF19I7 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV GX 1840 LABs 150 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CGX30CF19I7N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV GX 1840 LABs 150 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CGX30CF23C6 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV GX 1840 LABs 290 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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