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www.fairchildsemi.com
FAN8741/FAN8742 Rev. 1.0.1
F
1. 56-TSSOP-EP, Case 1: Single layer PCB with 1 signal plane only, PCB size is 76mm
×
114mm
×
1.6mm.
2. 56-TSSOP-EP, Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size is 76mm
×
114mm
×
1.6mm, Cu
plane sizes for power and ground is 74mm
×
62mm
×
0.035mm. Down pad of IC is soldered on the PCB.
3. 56-TSSOP-EP, Case 3: PCB condition is same to case 2 except via holes, which penetrate PCB all layers. Down pad of IC is sol-
dered on the PCB.
4. 56-SSOP-HS, Case 1: Single layer PCB with 1 signal plane only, PCB size is 76mm
×
114mm
×
1.6mm.
5. 56-SSOP-HS, Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size is 76mm
×
114mm
×
1.6mm, Cu
plane sizes for power and ground is 74mm
×
62mm
×
0.035mm.
6. Power dissipation is reduced by -12.8mW/
°
C for using above Ta=25
°
C in 56-TSSOP-EP, case 1.
7. Power dissipation is reduced by -25.6mW/
°
C for using above Ta=25
°
C in 56-TSSOP-EP, case 2.
8. Power dissipation is reduced by -32.8mW/
°
C for using above Ta=25
°
C in 56-TSSOP-EP, case 3.
9. Power dissipation is reduced by -24.8mW/
°
C for using above Ta=25
°
C in 56-SSOP-HS, case 1.
10. Power dissipation is reduced by -37.6mW/
°
C for using above Ta=25
°
C in 56-SSOP-HS, case 2.
11. Do not exceed P
D
and SOA (Safe Operating Area).
Power Dissipation Curve
Recommended Operating Conditions (Ta = 25
°
C)
Parameter
Min.
Typ.
Max.
Unit
Supply Voltage (Spindle Signal block)
4.5
5
5.5
V
Supply Voltage (Digital block)
4.5
5
5.5
V
Supply Voltage (Spindle driver)
4.5
12
13.2
V
Supply Voltage (Sled driver)
4.5
12
13.2
V
Supply Voltage (BTL driver)
4.5
12
SV
CC2
13.2
V
Supply Voltage (BTL signal block)
4.5
12
V
Output current(Spindle)
-
1.0
1.5
A
Output current(Focus, Tracking, Loading)
-
0.5
0.8
A
Output current(Sled)
-
0.5
0.8
A
25
50
75
100
125
150
175
1
2
3
4
5
Ambient temperature, [
o
C]
Power dissipation, [W]
SOA
56-SSOP-HS,case2
56-TSSOP-EP,case3
56-TSSOP-EP,case2
56-SSOP-HS,case1
56-TSSOP-EP,case1