- 您現在的位置：買賣IC網 > PDF目錄59976 > FGA204-638G (ADVANCED INTERCONNECTIONS CORP) BGA204, IC SOCKET PDF資料下載
參數資料
| 型號： | FGA204-638G |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA204, IC SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大小： | 53K |
| 代理商： | FGA204-638G |
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
2
REV. 4/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
Ball Grid Array
(BGA) Adapters
Adapter Features
Soldering BGA to Adapter subjects
BGA to less thermal stress than
soldering BGA directly to a PCB due
to Adapter’s lower mass.
Uses same footprint as BGA device.
Custom Adapters available for heat
sink attachments.
Specifications
Terminals:
Brass; Copper Alloy (C36000),
ASTM-B-16
Plating:
G – Gold over Nickel
Body Material:
F – FR-4 Glass Epoxy, U.L. Rated
94V-0
Terminals
1.27mm and
1.5mm Pitch
1.0mm Pitch
0.80mm Pitch
0.75mm Pitch
Standard Adapter (A)
Mates with Standard Socket (S)
Adapter size equals BGA device body + .079 in. (2.0mm)
Extraction Slot Adapter (AX)
Slots allow easy device/Adapter assembly removal from socket with
Advanced Extraction Tool without damaging valuable PCB
Mates with Extraction Socket (SB) or Guide Post Socket (SG)
Adapter size equals BGA device body + .157 in. (4.0mm)
Advanced BGA Adapter Extraction Tools
How To Order – BGA Adapters
1
F
G
A
XXXX - 638
G
Footprint Dash#
If Applicable*
Terminal Plating
G - Gold
Terminal Type
See options at left
Body Type
F - FR-4
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter [1.5, 1.27, & 1.0mm Pitch only]
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Number of Positions
*See BGA Footprint Booklet
or web site
.018/(0.46)
Dia.
.182
(4.62)
Type -638
.011/(0.28)
Dia.
.159
(4.04)
Type -715
DEVICE PACKAGE SIZE
< 1.024 (26mm)
> 1.024 (26mm)
Tool P/N
5566
5504
Blade Width
.373 in.
.675 in.
Blade Width
BGA Body + .079/(2.0)
BGA Device
.039/(1.0)
BGA Device
BGA Body + .157/(4.0)
.079/(2.0)
P/N 5504
P/N 5566
.011/(0.28)
Dia.
.146
(3.71)
Type -700
Now Available In
0.75mm Pitch
.008/(0.20)
Dia.
.142
(3.61)
Type -757
相關PDF資料 |
PDF描述 |
|---|---|
| FGA121-638G | BGA121, IC SOCKET |
| FGA100-638G | BGA100, IC SOCKET |
| FGAX584-638G | BGA584, IC SOCKET |
| FGAX493-638G | BGA493, IC SOCKET |
| FGAX320-638G | BGA320, IC SOCKET |
相關代理商/技術參數 |
參數描述 |
|---|---|
| FGA20N120FTD | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:1200V, 20A Trench IGBT |
| FGA20N120FTDTU | 功能描述:IGBT 晶體管 1200V N-Chan Trench RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發射極最大電壓:20 V 在25 C的連續集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
| FGA20S120M | 功能描述:IGBT 晶體管 1200V 20A SA FS RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發射極最大電壓:20 V 在25 C的連續集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
| FGA20S125P | 功能描述:IGBT 晶體管 2.5A Output Current GateDrive Optocopler RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發射極最大電壓:20 V 在25 C的連續集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
| FGA20S140P | 功能描述:IGBT 晶體管 USB Port Multimedia Switch RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發射極最大電壓:20 V 在25 C的連續集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
發布緊急采購，3分鐘左右您將得到回復。