- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄59974 > FGA521-720G (ADVANCED INTERCONNECTIONS CORP) BGA521, IC SOCKET PDF資料下載
參數(shù)資料
| 型號(hào)： | FGA521-720G |
| 廠商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分類(lèi)： | 插座 |
| 英文描述： | BGA521, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大小： | 170K |
| 代理商： | FGA521-720G |
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 Fax 401-823-8723 Email info@advintcorp.com Internet http://www.advintcorp.com
inch/(mm
)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 4
Ball Grid Array
(BGA) Adapters
Features
:
Soldering BGA Device to adapter subjects
BGA to less thermal stress than soldering
BGA directly to a PCB due to the adapter’s
lower mass.
Uses same footprint as BGA device.
Custom adapters available for heat sink
attachment.
Terminals:
Brass - Copper Alloy (C36000),
ASTM-B-16
Plating:
G - Gold over Nickel
Body Material:
FR-4 Glass Epoxy, U.L. Rated 94V-O
How It Works:
Standard Adapter (A):
Mates with Standard Socket (S)
Adapter size equals BGA Device
body + .079/(2.0)
BGA Adapters
How To Order
1
F
G
A
XXX -638
G
Footprint Dash#
If Applicable*
Terminal Plating
G - Gold
Terminal Type
Body Type
F - FR-4
Model Type
A = Standard Adapter
AX = Extraction Slot Adapter
(1.5, 1.27, 1.0mm Pitch only)
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
Number of Positions
*See BGA Footprint Section or web site
1.27mm & 1.5mm Pitch
Type -638
.018
(0.46) Dia.
.182
(4.62)
1.0mm Pitch
Type -715
.011/(0.28)
Dia.
.159
(4.04)
0.80mm Pitch
Type -700
.011
(0.28)Dia.
.146
(3.71)
0.75mm Pitch
Type -757
.008
(0.20)Dia.
.142
(3.61)
BGA Body + .079/(2.0)
BGA Device
.039/(1.0)
Extraction Slot Adapter (AX):
Slots allow AIC extraction tool (sold
separately) to easily remove device/
adapter assembly from socket.
Mates with Extraction Socket (SB)
or Guide Post Socket (SG)
Adapter size equals the BGA
Device body + .157/(4.0)
BGA Device
BGA Body + .157/(4.0)
.079/(2.0)
BGA Adapter Extraction Tool:
Insert “T” bar end of tool into extraction slot adapter.
Slide tool to end of slot and pry adapter from socket.
Repeat in additional slots until adapter is separated from socket.
Blade Width
Tool P/N
5566
5504
.373/(9.5mm)
.675/(17.1mm)
Blade Width
Device Package Size
< 1.024 (26mm) > 1.024 (26mm)
P/N 5566
P/N 5504
Terminals
DEVICE
ADAPTER
SOCKET
PC BOARD
Reflow (solder) BGA
Device to Adapter
Reflow (solder)
Socket to PCB
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FGA540-720G | BGA540, IC SOCKET |
| FGA600-720G | BGA600, IC SOCKET |
| FGA625-720G | BGA625, IC SOCKET |
| FGA720-720G | BGA720, IC SOCKET |
| FGA96-720G | BGA96, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FGA-60 | 制造商:Richco 功能描述:Fan Gasket,Black,60MM 制造商:Richco 功能描述:Bulk |
| FGA60N60UFD | 制造商:FAIRCHILD 制造商全稱(chēng):Fairchild Semiconductor 功能描述:600V, 60A Field Stop IGBT |
| FGA60N60UFDTU | 功能描述:IGBT 晶體管 600V 60A FIELD STOP RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發(fā)射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發(fā)射極最大電壓:20 V 在25 C的連續(xù)集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
| FGA60N65SMD | 功能描述:IGBT 晶體管 650V, 60A Field Stop IGBT RoHS:否 制造商:Fairchild Semiconductor 配置: 集電極—發(fā)射極最大電壓 VCEO:650 V 集電極—射極飽和電壓:2.3 V 柵極/發(fā)射極最大電壓:20 V 在25 C的連續(xù)集電極電流:150 A 柵極—射極漏泄電流:400 nA 功率耗散:187 W 最大工作溫度: 封裝 / 箱體:TO-247 封裝:Tube |
| FGA-70 | 制造商:Richco 功能描述:Fan Gasket,Black,70MM 制造商:Richco 功能描述:Bulk 制造商:Richco 功能描述:FAN GASKET BLACK 70MM |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。