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參數資料
型號: FM820-B
廠商: 美麗微半導體有限公司
英文描述: Chip Schottky Barrier Diodes - Silicon epitaxial planer type
中文描述: 肖特基二極管芯片-硅外延式龍門
文件頁數: 1/2頁
文件大小: 69K
代理商: FM820-B
FM820-B THRU FM840-B
(V)
(V)
(V)
(V)
(
o
C)
FM820-B
SK82
20
14
20
FM830-B
SK83
30
21
30
FM840-B
SK84
40
28
40
SYMBOLS
MARKING
CODE
-55 to +125
Operating
temperature
V
RRM
*1
V
RMS
*2
V
R
*3
V
F
*4
0.65
MAXIMUM RATINGS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX.
UNIT
Forward rectified current
See Fig.1
I
O
8.0
A
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
I
FSM
150
A
V
R
= V
RRM
T
A
= 25
o
C
5.0
mA
V
R
= V
RRM
T
A
= 100
o
C
50
mA
Thermal resistance
Junction to ambient
R
q
JA
55
o
C / w
Diode junction capacitance
f=1MHz and applied 4vDC reverse voltage
C
J
700
pF
Storage temperature
T
STG
-55
+150
o
C
Reverse current
I
R
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
Chip Schottky Barrier Diodes
Silicon epitaxial planer type
Formosa MS
0.213(5.4)
0.197(5.0)
0.016(0.4) Typ.
0.142(3.6)
0.126(3.2)
0.173(4.4)
0.157(4.0)
0.075(1.9)
0.067(1.7)
0.040 (1.0) Typ.
0.040(1.0) Typ.
Dimensions in inches and (millimeters)
SMB
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDECDO-214AA
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : 0.00878 ounce, 0.293 gram
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相關代理商/技術參數
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