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參數資料
| 型號： | FMM5125X |
| 廠商： | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 英文描述： | 15/60GHz Frequency Multiplier MMIC |
| 中文描述： | 15/60GHz倍頻單片集成電路 |
| 文件頁數： | 8/9頁 |
| 文件大小： | 233K |
| 代理商： | FMM5125X |
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15/60GHz Frequency Multiplier MMIC
FMM5125X
DIE ATTACH
1) The die-attach station must have accurate temperature control, and an inert forming gas should
be used.
2)Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Perform Volume : per next Figure
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N +/- 0.0196 N
Stage Temperature : 215 deg.C +/- 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
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Area of Chip Back Surface (mm^2)
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FMM5125X
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