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參數資料
型號: FMM5820X
廠商: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
英文描述: Ka-Band Power Amplifier MMIC
中文描述: Ka波段單片功率放大器
文件頁數: 12/13頁
文件大小: 781K
代理商: FMM5820X
12
Ka-Band Power Amplifier MMIC
FMM5820X
DIE ATTACH
1) The die-attach station must have accurate temperature control, and an inert forming gas should
be used.
2) Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature: 300 to 310
Time : less than 15 seconds
AuSn Preform Volume : per next Figure
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N ± 0.0196 N
Stage Temperature : 215
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
± 5
0
500
1000
1500
2000
2500
0
2
4
6
8
10
12
14
16
18
20
Area of Chip Bach Surface (mm^2)
V
-
/
3
)
FMM5820X
相關PDF資料
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FMM5822X K-Band Power Amplifier MMIC
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相關代理商/技術參數
參數描述
FMM5822VU 制造商:SUMITOMO ELECTRIC Device Innovations Inc 功能描述:C to Ka-Band, Power Amplifier MMIC, 17.7-19.7GHz, 32dBm, 1100mA, Bulk
FMM5822X 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:K-Band Power Amplifier MMIC
FMM5823X 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:K-Band Power Amplifier MMIC
FMM5826X 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:Ka-Band Power Amplifier MMIC
FMM5829X 制造商:EUDYNA 制造商全稱:Eudyna Devices Inc 功能描述:K-Band Power Amplifier MMIC
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