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參數資料
| 型號： | FN3138 |
| 廠商： | Integrated Silicon Solution, Inc. |
| 元件分類： | RS-232 |
| 英文描述： | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| 中文描述： | 5V的高速RS - 232收發器與0.1uF電容 |
| 文件頁數： | 19/20頁 |
| 文件大小： | 712K |
| 代理商： | FN3138 |
19
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
μ
α
0.25(0.010)
B
M
M
0.25
0.010
GAUGE
PLANE
A2
M28.209
(JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 1 3/95
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