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參數(shù)資料
| 型號： | FS0401BD00TR |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | SURFACE MOUNT SCR |
| 中文描述： | 表面貼裝可控硅 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大小： | 164K |
| 代理商： | FS0401BD00TR |
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Igt (Tj)
Igt (Tj = 25 oC)
Fig. 5: Relative variation of gate trigger current
and holding current versus junction temperature.
-40 -20
0
60
80 100 120 140
Ih (Tj)
Ih (Tj = 25 oC)
40
20
Tj (oC)
Ih
Igt
1.00
0.10
0.01
K=[Zth(j-a) / Rth(j-a)]
Fig. 4-2: Relative variation of thermal
impedance junction to ambient versus pulse
duration. (recommended pad layout)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
tp (s)
Tamb (oC)
FS04...D
SURFACE MOUNT SCR
0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5
1
1.5
P (W)
Fig. 1: Maximum average power dissipation
versus average on-state current
0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
25
50
100
125
P (W)
Fig. 2: Correlation between maximum average power dissipation and
maximum allowable temperatures (Tamb and T case) for different
thermal resistances heatsink+contact.
T case (oC)
125
Fig. 3: Average and DC on-state current versus
ambient temperature (device mounted on FR4
with recommended pad layout)
Jun- 02
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
I T(AV) (A)
0
25
100
125
50
75
2
2.5
3
Tamb (oC)
IT(AV)(A)
3.5
α
360 o
75
120
115
Rth= 37C/W
Rth= 15C/W
Rth= 10C/W
Rth= 0C/W
Rth= 5C/W
α=
180o
α
= 180 o
DC
1.0
0.5
0.2
0.1
K=[Zth(j-c) / Rth(j-c)]
Fig. 4-1: Relative variation of thermal
impedance junction to case versus pulse
duration.
1E-3
1E-2
1E-1
1E+0
tp (s)
α
= 80 o
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