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參數資料
| 型號： | FSLM2520-100-J |
| 廠商： | TOKO Inc. |
| 英文描述： | Wirewound Chip Inductors |
| 中文描述： | 繞線片式電感器 |
| 文件頁數： | 1/2頁 |
| 文件大小： | 28K |
| 代理商： | FSLM2520-100-J |
17
Meeting Your Needs
1.800.PIK.TOKO
1.847.297.0070
www.tokoam.com
Wirewound Chip Inductors
TYPE
FSLM2520
Features
Inductance Range: 0.1-220
μ
H
Temperature Coefficient: 750ppm/
°
C
Temperature Range: –40
°
C to +85
°
C
Typical max Q: 40 ~ 50
Proprietary wire-wound structure with welded
terminations offers high reliability
Superior solderability and high heat-resistance for flow
and reflow soldering
Low profile: 1008 footprint 1.7mm max (1.6mm typ.)
S-parameter data available upon request
Packaged on tape and reel in 2,000 piece quantity
Recommended patterns:
1.6
±
0.1
1.4
0
0.5
2.0
2
Tolerance:
±
0.2
Unit: mm
1.2
1.5
1.2
Unit: mm
1
Part Numbering
Q-FREQUENCY CHARACTERISTICS
50
40
30
20
10
1
100
10
0
Frequency (MHz)
60
70
Q
47
μ
H
4.7
μ
H
0.47
μ
H
The FSLM2520 Series is a ferrite core wirewound surface
mount chip inductor which conforms to the EIA standard
1008 footprint. Its proprietary welded termination architec-
ture offers superior reliability and high heat-resistance for flow
and reflow soldering capability. It is an economical choice
for general signal conditioning, RF or IF filtering applications,
or as matching elements.
FSLM 2520 - R10 K
Tolerance
(J=
±
5%, K=
±
10%)
Inductance
Footprint
(l x win mm
Type Name
相關PDF資料 |
PDF描述 |
|---|---|
| FSLM2520-100-K | Wirewound Chip Inductors |
| FSLM2520-101-J | Wirewound Chip Inductors |
| FSLM2520-101-K | Wirewound Chip Inductors |
| FSLM2520-120-J | Wirewound Chip Inductors |
| FSLM2520-120-K | Wirewound Chip Inductors |
相關代理商/技術參數 |
參數描述 |
|---|---|
| FSLM2520-100J=P2 | 制造商:TOKO Inc 功能描述: |
| FSLM2520100JP2 | 制造商:TOKO Inc 功能描述: |
| FSLM2520-100-K | 制造商:TOKO 制造商全稱:TOKO, Inc 功能描述:Wirewound Chip Inductors |
| FSLM2520-101 | 制造商:TOKO 制造商全稱:TOKO, Inc 功能描述:Wire Wound Chip Inductors |
| FSLM2520-101J | 制造商:TOKO Inc 功能描述:Wire Wound Chip Inductor LLM2520 100uH 制造商:TOKO Inc 功能描述:Wire Wound Chip Inductor 100uH 5% |
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