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參數資料
| 型號： | FTR-B3GB1.5Z-B10 |
| 廠商： | Fujitsu Limited |
| 英文描述： | VME 6U 68040 based CPU with Industry Pack support |
| 中文描述： | 繼電器2的帳戶的CT 1A條（用于交換信號） |
| 文件頁數： | 10/11頁 |
| 文件大小： | 1110K |
| 代理商： | FTR-B3GB1.5Z-B10 |
10
Ftr-B3 series
roHs Compliance and Lead Free relay Information
Reflow Solder condtion
3. Moisture sensitivity
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Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. tin Whisker
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SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found
by our in-house test.
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
Soldering:
maximum 120C
dip within 5 sec. at
260C soler bath
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
maximum 360C
maximum 3 sec.
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
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Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays.
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All signal and most power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
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It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
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“LF” is marked on each outer and inner carton. (No marking on individual relays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
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We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2.
Recommended Lead Free Solder Profile
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Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from
February 2005.
max. 120 sec.
90~120 sec.
20~30 sec.
(duration)
Cooling
Pre-heating
Soldering
Peak
T
emp.: max. 250°C
250
220
130
170
t
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| FTR-B3SA012Z-B10 | 6U VME PowerPC Computing Node |
| FTR-B3SA024Z-B10 | 6U VME PowerPC Computing Node |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| FTR-B3GB4.5Z | 功能描述:低信號繼電器 - PCB SIGNAL RoHS:否 制造商:NEC 觸點形式:2 Form C (DPDT-BM) 觸點電流額定值: 線圈電壓:5 V 最大開關電流:1 A 線圈電流:1 A 線圈類型:Non-Latching 功耗:140 mW 端接類型:SMT 絕緣: 介入損耗: |
| FTR-B3GB4.5Z-B10 | 功能描述:低信號繼電器 - PCB SIGNAL RoHS:否 制造商:NEC 觸點形式:2 Form C (DPDT-BM) 觸點電流額定值: 線圈電壓:5 V 最大開關電流:1 A 線圈電流:1 A 線圈類型:Non-Latching 功耗:140 mW 端接類型:SMT 絕緣: 介入損耗: |
| FTR-B3GB4.5Z-B-10 | 制造商:FUJITSU 功能描述:Electromechanical Relay DPDT 2A 4.5VDC 203Ohm Surface Mount 制造商:Fujitsu 功能描述:Electromechanical Relay DPDT 2A 4.5VDC 203Ohm Surface Mount |
| FTR-B3GB4.5Z-RF | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:ULTRA MINIATURE Flat High-Frequency Relay Surface mount, 1GHz-Band, 2 Form C |
| FTR-B3-RF | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:ULTRA MINIATURE Flat High-Frequency Relay Surface mount, 1GHz-Band, 2 Form C |
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