
A134
1.27mm Pitch Connector
FX1 Series
Power
Supply
Ground
Signal
Mating
Removal
FX1V (3 step sequence)
DIN duplex density mount has been achieved.
(DIN 96 contacts and FX1 192 (96x2)
Photo 1
Sequence Structure
(Pin contact sequence)
1
2
Row B
Row A, row C
1
2
3
B1
to
B4, B45
to
B52, B93
to
B96
B5
to
B44, B53
to
B92
Row A, row C
*FX1 Series (2 step sequence)
*FX1 Series (3 step sequence)
Figure 2
Setting row B to ground, if active cable insertion and
extraction are performed as power supply, arc will
occur between contact and contact. The row B
contact structure is constructed to separate arc
occurrence point a and normal contact point b, and
minimizes affects on the contact.
I
Features
1.
High density and space saved-DIN Duplex Mount Achieved
The alignment of the mating area in 4-row allows to duplex the
number of contacts in the nearly equivalent mount square as for
the conventional DIN connector.(Refer to photo (1).)
2. High Current and High Voltage
Two-thirds of total contact numbers are used for half pitch
signaling contact, while the other one-third thereof is used for the
power ground contact. Power ground contact corresponds to
high current (1A) and high voltage (250V).
3. Sequence Structure
Considering insertion/extraction in active power mode and
maintenance on the end user side, the FX series is designed in a
mechanism that can afford the time different contact at three
steps. (For details, refer to Figure (2) as shown on the right.)
4. Mis-insertion Prevent
Provide the insertion guide on both ends of connector, and widen
an inductive area in order to prevent mis-insertion.